XPE uses your design and environmental input, then combines this information with the device data model to compute and present an estimated distribution of the power in the targeted device.
XPE presents multiple views of the power distribution.
- Power and Current of Voltage Supplies
- For each required voltage source, power and current is useful to select and size power supply components, such as regulators. Supply power includes both off-chip and on-chip dissipated power. Dynamic power is reported on an individual sheet while the current per supply is reported on the Power Design sheet.
- On-Chip Power Per Resource Type
- For each type of user logic in the design, XPE reports the expected power. This allows you to experiment with architecture, resources, and implementation trade-off choices to remain within the allotted power budget.
- Total On-Chip Thermal Power
- XPE lets you enter the thermal solution settings (Theta Ja) and the ambient temperature (Ta) and reports thermal properties of the device for your application, such as the expected junction temperature. It is recommended that you run the thermal simulation and not rely on XPE to get information about the thermal solution required for your system.
The Summary sheet in XPE shows the total on-chip power for the device. Other sheets show power based on resource usage.