There are two separate aspects to evaluate when integrating Xilinx devices in a system. Typically designers first evaluate the device current drawn on each voltage supply to ensure all voltage sources can provide enough power for the device to function properly. Second, designers need to know how much of that supplied power is consumed by the device itself as opposed to power supplied to off-chip components such as board termination networks. The power consumed on-chip, also referred to as thermal power, generates heat that must be transferred to the environment to maintain the device junction temperature within the normal operating range. Figure 1 shows the on-chip power contributing to junction temperature (On-Chip Power panel) and the total supply power (Power Supply panel).
In Zynq UltraScale+ MPSoC, power supply panel will change based on the selected device It will display link for PS Rails as well as RF-ADC-DAC Power Rails sheets as shown in Figure 2.