- Select the best device for the product.
Increasingly, power is becoming one of the primary factors for selecting a device. Select the device that best meets your density, functionality, and performance requirements and will also meet your power budget.
- Minimize the number of devices.
This saves space, I/O interconnect power, total leakage, and other factors. Typically, replacing multiple components (for example, processor and device) with a single larger device consumes less static power.
- Select the smallest device possible.
This reduces leakage. Typically in a device family the same package may be available with different die sizes. You can, for instance, use a larger die during the prototyping and pre-series phase, then move to a smaller die for volume production.
- Select the largest package possible.
This increases heat dissipation. A larger package has a larger area to dissipate the die heat into the environment. A larger heat sink can be attached to the package upper side and more heat can escape onto the PCB via the bottom ball grid array.
- Use low voltage devices.
Some device families are available with a lower power option. The lower core voltage requirements translate into significant static and dynamic power savings.
- Use low leakage devices.
Some device families are available with a lower leakage or static power options in the form of specific speed or temperature grades. These devices may cost a bit more to purchase but you or the end user may be able to more than offset this with savings on the electricity bill or cooling hardware and system maintenance.