FG676, FG680, FG900, FG1156, BF957, FF672, FF896, FF1152, FF1704, SF363, and CF1144

Device Reliability Report (UG116)

Document ID
UG116
Release Date
2023-05-17
Revision
10.17 English
Table 1. Package Details (All Dimensions in mm)
Package Size I/O Pitch Ball/ Column Size Pad Opening Pad Type Die Size Substrate
FG676 27 x 27 676 1.00 0.60 0.46 SMD 17.8 x 17.8 x 0.3 0.56 thick, 4-layer
FG680 40 x 40 680 1.00 0.60 0.46 SMD 20.3 x 20.3 x 0.3 0.98 thick, 3-layer
FG900 31 x 31 900 1.00 0.60 0.46 SMD 17.0 x 17.0 x 0.3 0.56 thick, 4-layer
FG1156 35 x 35 1,156 1.00 0.60 0.46 SMD 23 x 21 x 0.3 0.56 thick, 4-layer
BF957 40 x 40 957 1.27 0.75 0.61 SMD 22 x 20 x 0.7 1.152 thick, 6-layer
FF672 27 x 27 672 1.00 0.60 0.53 SMD 12 x 10 x 0.7 1.152 thick, 6-layer
FF896 31 x 31 896 1.00 0.60 0.53 SMD 10 x 10 x 0.7 1.152 thick, 6-layer
FF1152 35 x 35 1,152 1.00 0.60 0.53 SMD 22 x 20 x 0.7 1.152 thick, 6-layer
FF1704 42.5 x 42.5 1,704 1.00 0.60 0.53 SMD 26 x 22 x 0.7 1.152 thick, 6-layer
SF363 17 x 17 363 0.8 0.50 0.40 SMD 10 x 10 x 0.3 0.60 thick, 4-layer
CF1144 35 x 35 1,144 1.00 0.52 0.80 SMD 22 x 20 x 0.7 1.59 thick, 10-layer

Mother Board Design and Assembly Details

  • 8-layer, FR-4, 220 x 140 x 2.3622 mm size, HASL finish
  • 0.5 mm pad diameter/0.65 mm solder mask opening (NSMD pads)
  • Board layer structure: signal/GND/signal/power/signal/GND/signal/power
  • Power/GND layer has 70% metal. Internal signal layer has 40% metal.
  • 0.1524 mm laser cut stencil, 0.50 mm aperture, alpha metals WS609 paste

Test Condition

  • 0°C – 100°C, 10-minutes dwell, 5-minute ramps, 2 cycles/hour

Failure Criteria

  • Continuous scanning of daisy chain nets (every 2 minutes)
  • OPEN: Resistance of net > threshold resistance (300Ω)
  • FAIL: At least 2 opens within one cycle, log 15 failures for each net
Table 2. Summary of Test Results
Package Cycles Completed # Tested # Failed First Failure (Cycle) Characteristic Life (Cycle)
FG676 7,027 30 30 4,686 6,012
FG680 4,000 30 0 NA NA
FG900 7,027 28 28 4,405 5,344
FG1156 5,000 32 25 2,786 4,892
BF957 4,145 35 35 1,958 3,662
FF672 5,840 30 30 3,764 4,881
FF896 7,027 12 10 5,607 6,783
FF1152 4,158 30 30 2,668 3,822
SF363 (Lot 1) 2,370 24 21 1,642 2,048
SF363 (Lot 2) 2,288 24 24 1,555 1,999
FF1704 4,150 35 35 3,003 3,389
CF1144 5,000 21 0 NA NA

Weibull Plots

Figure 1. Cycles to Failure in the Second-Level Reliability Tests for FG676
Figure 2. Cycles to Failure in the Second-Level Reliability Tests for FG900
Figure 3. Cycles to Failure in the Second-Level Reliability Tests for FG1156
Figure 4. Cycles to Failure in the Second-Level Reliability Tests for BF957
Figure 5. Cycles to Failure in the Second-Level Reliability Tests for FF672
Figure 6. Cycles to Failure in the Second-Level Reliability Tests for FF896
Figure 7. Cycles to Failure in the Second-Level Reliability Tests for FF1152
Figure 8. Cycles to Failure in the Second-Level Reliability Tests for SF363
Figure 9. Cycles to Failure in the Second-Level Reliability Tests for FF1704