Package | Size | I/O | Pitch | Ball/ Column Size | Pad Opening | Pad Type | Die Size | Substrate |
---|---|---|---|---|---|---|---|---|
FG676 | 27 x 27 | 676 | 1.00 | 0.60 | 0.46 | SMD | 17.8 x 17.8 x 0.3 | 0.56 thick, 4-layer |
FG680 | 40 x 40 | 680 | 1.00 | 0.60 | 0.46 | SMD | 20.3 x 20.3 x 0.3 | 0.98 thick, 3-layer |
FG900 | 31 x 31 | 900 | 1.00 | 0.60 | 0.46 | SMD | 17.0 x 17.0 x 0.3 | 0.56 thick, 4-layer |
FG1156 | 35 x 35 | 1,156 | 1.00 | 0.60 | 0.46 | SMD | 23 x 21 x 0.3 | 0.56 thick, 4-layer |
BF957 | 40 x 40 | 957 | 1.27 | 0.75 | 0.61 | SMD | 22 x 20 x 0.7 | 1.152 thick, 6-layer |
FF672 | 27 x 27 | 672 | 1.00 | 0.60 | 0.53 | SMD | 12 x 10 x 0.7 | 1.152 thick, 6-layer |
FF896 | 31 x 31 | 896 | 1.00 | 0.60 | 0.53 | SMD | 10 x 10 x 0.7 | 1.152 thick, 6-layer |
FF1152 | 35 x 35 | 1,152 | 1.00 | 0.60 | 0.53 | SMD | 22 x 20 x 0.7 | 1.152 thick, 6-layer |
FF1704 | 42.5 x 42.5 | 1,704 | 1.00 | 0.60 | 0.53 | SMD | 26 x 22 x 0.7 | 1.152 thick, 6-layer |
SF363 | 17 x 17 | 363 | 0.8 | 0.50 | 0.40 | SMD | 10 x 10 x 0.3 | 0.60 thick, 4-layer |
CF1144 | 35 x 35 | 1,144 | 1.00 | 0.52 | 0.80 | SMD | 22 x 20 x 0.7 | 1.59 thick, 10-layer |
Mother Board Design and Assembly Details
- 8-layer, FR-4, 220 x 140 x 2.3622 mm size, HASL finish
- 0.5 mm pad diameter/0.65 mm solder mask opening (NSMD pads)
- Board layer structure: signal/GND/signal/power/signal/GND/signal/power
- Power/GND layer has 70% metal. Internal signal layer has 40% metal.
- 0.1524 mm laser cut stencil, 0.50 mm aperture, alpha metals WS609 paste
Test Condition
- 0°C – 100°C, 10-minutes dwell, 5-minute ramps, 2 cycles/hour
Failure Criteria
- Continuous scanning of daisy chain nets (every 2 minutes)
- OPEN: Resistance of net > threshold resistance (300Ω)
- FAIL: At least 2 opens within one cycle, log 15 failures for each net
Package | Cycles Completed | # Tested | # Failed | First Failure (Cycle) | Characteristic Life (Cycle) |
---|---|---|---|---|---|
FG676 | 7,027 | 30 | 30 | 4,686 | 6,012 |
FG680 | 4,000 | 30 | 0 | NA | NA |
FG900 | 7,027 | 28 | 28 | 4,405 | 5,344 |
FG1156 | 5,000 | 32 | 25 | 2,786 | 4,892 |
BF957 | 4,145 | 35 | 35 | 1,958 | 3,662 |
FF672 | 5,840 | 30 | 30 | 3,764 | 4,881 |
FF896 | 7,027 | 12 | 10 | 5,607 | 6,783 |
FF1152 | 4,158 | 30 | 30 | 2,668 | 3,822 |
SF363 (Lot 1) | 2,370 | 24 | 21 | 1,642 | 2,048 |
SF363 (Lot 2) | 2,288 | 24 | 24 | 1,555 | 1,999 |
FF1704 | 4,150 | 35 | 35 | 3,003 | 3,389 |
CF1144 | 5,000 | 21 | 0 | NA | NA |
Weibull Plots
Figure 1. Cycles to Failure in the Second-Level Reliability Tests for
FG676
Figure 2. Cycles to Failure in the Second-Level Reliability Tests for
FG900
Figure 3. Cycles to Failure in the Second-Level Reliability Tests for
FG1156
Figure 4. Cycles to Failure in the Second-Level Reliability Tests for
BF957
Figure 5. Cycles to Failure in the Second-Level Reliability Tests for
FF672
Figure 6. Cycles to Failure in the Second-Level Reliability Tests for
FF896
Figure 7. Cycles to Failure in the Second-Level Reliability Tests for
FF1152
Figure 8. Cycles to Failure in the Second-Level Reliability Tests for
SF363
Figure 9. Cycles to Failure in the Second-Level Reliability Tests for
FF1704