Revision History

Device Reliability Report (UG116)

Document ID
UG116
Release Date
2023-05-17
Revision
10.17 English

The following table shows the revision history for this document.

Date Revision
05/17/2023 Version 10.17
The Reliability Program Removed 150 nm process technology from Table 1. Removed row for XC18Vxxx/XCFxx devices and note 1 from Table 1. Added ZU1, AU10P, and AU15P to Table 9. Added VM1302, VM1402, VP1202, VC1802, VC1702, VC1502, and VE1752 to Table 10. Updated device hours for 7 nm, 16 nm, 20 nm, 28 nm, 40 nm, 45 nm, 65 nm, and 90 nm process technologies and removed 150 nm process technology in Table 1. In Table 1 and Table 2, updated soft error rates for 16 nm and 7 nm process technologies, and removed note about real-time SEU rate data. In Table 3, updated soft error rate for 7 nm process technology, and removed note about real-time SEU rate data.
Results by Product Family Updated tables with the latest test results.
Results by Package Type Updated tables with the latest test results.
06/29/2022 Version 10.16
The Reliability Program Removed XC7VH580T and XC7VH870T from Table 7. Added ZU42DR, ZU65DR, ZU67DR, AU20P, and AU25P to Table 9. Updated device hours for 7 nm, 16 nm, 180 nm, 350 nm/250 nm, and 350 nm process technology in Table 1. In Table 1 and Table 2, updated soft error rates for 20 nm and 16 nm process technologies.
Results by Product Family Updated tables with the latest test results.
Results by Package Type Updated tables with the latest test results.
11/10/2021 Version 10.15
The Reliability Program In Table 1, added 7 nm and removed 130 nm process technology. In ESD and Latch-up Summary, updated specifications and removed list of devices. Removed notes 2 and 3 from Table 1. Added Table 10. Removed Table 9: ESD and Latch-up Data for XC2VPxxx. Added VU57P, ZU58DR, and ZU59DR to Table 9. In Table 1, added 7 nm process technology, updated device hours and FIT for 16 nm, 20 nm, 28 nm, 40 nm, 45 nm, 65 nm, 90 nm, and 220 nm/180 nm, and removed 130 nm. Added 7 nm technology node to Table 1, Table 2, and Table 3. In Table 1 and Table 2, updated soft error rates for 20 nm and 16 nm process technologies, removed 130 nm and 150 nm, and added note about real-time data in Versal devices.
Results by Product Family Updated tables with the latest test results.
Results by Package Type Updated tables with the latest test results.
04/23/2021 Version 10.14
The Reliability Program Removed XCVxxxE from Table 1. Removed 180 nm (Virtex-E) row from Table 1 and Table 2. Added KU19P, VU23P, ZU43DR, ZU46DR, ZU47DR, ZU48DR, and ZU49DR to Table 9. Updated device hours for 16 nm, 20 nm, 28 nm, 40 nm, 45 nm, 65 nm, 130 nm, 180 nm, 220 nm/180 nm, and 350 nm/250 nm in Table 1. Updated soft error rates for 20 nm and 16 nm process technologies in Table 1 and Table 2.
Results by Package Type Updated tables with the latest test results.
Results by Product Family Updated tables with the latest test results.
10/30/2020 Version 10.13
The Reliability Program Removed note about HTS stress from Table 3. Added VU19P to Table 9. Updated device hours for 16 nm, 20 nm, 28 nm, 40 nm, 45 nm, 90 nm, and 180 nm in Table 1. Updated soft error rates for 20 nm and 16 nm process technologies in Table 1 and Table 2.
Results by Product Family Updated tables with the latest test results.
Results by Package Type Updated tables with the latest test results.
04/06/2020 Version 10.12
The Reliability Program Updated ESD and latch-up data for UltraScale+ devices (Table 9), summary failure rates (Table 1) and soft error rates (Table 1, Table 2, and Table 3) for 28 nm, 20 nm, and 16 nm process technologies.
Results by Product Family Updated tables with the latest test results.
Results by Package Type Updated tables with the latest test results.
09/18/2019 Version 10.11
The Reliability Program Updated summary failure rates (Table 1) and soft error rates (Table 1 and Table 2) for 28 nm, 20 nm, and 16 nm process technologies.
Results by Product Family Updated tables with the latest test results.
Board-Level Reliability Tests Updated tables with the latest test results.
03/22/2019 Version 10.10
The Reliability Program Updated summary failure rates (Table 1) and soft error rates (Table 1 and Table 2) for 28 nm, 20 nm, and 16 nm process technologies.
Results by Product Family Updated tables with the latest test results.
Board-Level Reliability Tests Updated tables with the latest test results. Added device type XCVU7P.
09/10/2018 Version 10.9
The Reliability Program Added devices for Spartan®-7 FPGAs to Table 7. Added a column for RF-ADC and RF-DAC HBM and CDM data to Table 9. Updated Table 1, Table 1, and Table 2.
Results by Product Family Updated tables with the latest test results. Added tables for TH Test Results for Si Gate CMOS Device Types in the UltraScale Family and the UltraScale+ family. Removed device types XC2Sxxx, XC3Sxxx, and XC3SDxxxA. Added Table 2-43, HAST Test Results for Si Gate CMOS Device Type XC6Sxxx. Removed the section Unbiased High Accelerated Stress Test.
Board-Level Reliability Tests Updated tables with the latest test results. Added packages CPG196, SFV625, SFV784, FBV900, FBV484, FFG323, FFG324, FFG363, FFG1513, FFG1696, FFG1704, FFG1738, FFG1759, FFV901, FFV1136, FFV1148, FFV1152, FFV1153, FFV1154, FFV1156, FFV1156, FFV1157, and FFV1158. Removed packages CSG144, FFG900, FGG256, FGG320, FGG484, FGG400, FGG1156, FLV1517, FLV1924, FLV2104, HCG1932, PQG160, PQG208, PQG240, QFG32, and QFG48.
07/12/2018 Version 10.8.2
Throughout Editorial updates only. No technical content updates.
05/03/2018 Version 10.8.1
Results by Product Family Corrected UltraScale and UltraScale+ device rows in Table 2-17.
03/22/2018 Version 10.8
The Reliability Program Added device XC7S50 to Table 7. Added PS-GTR transceivers to Table 9. Updated Table 1, Table 1, and Table 2.
Results by Product Family Updated tables with the latest test results.
Board-Level Reliability Tests Updated tables with the latest test results. HTS failures for device type XCVU9P in Table 3-37 changed to 0. Added test results for package FTG196 for device type XA7S50 (Table 3-54).
11/17/2017 Version 10.7.1
  Updated the SEU link above Table 1.
11/13/2017 Version 10.7
The Reliability Program Updated Table 1 and Table 1 for 0.016 μm devices. Added Table 9 for UltraScale+ devices. Updated SEU and Soft Error Rate Measurements, Table 1, and Table 2.
Results by Product Family Updated tables for 0.016 μm devices. Updated Updated Table 2-1 and Table 2-14. Added Table 2-16, Table 2-25, Table 2-40, and Table 2-55.
Board-Level Reliability Tests Adjusted Weibull plots for clarity and accuracy. Added device types (Table 3-16 and Table 3-37). FFV1927 was corrected to FFG1928. Updated FFG1928 characteristic life in Table 2.
07/11/2017 Version 10.6.1
Throughout Made typographical changes.
07/10/2017 Version 10.6
The Reliability Program Updated ESD and LU test data. Added a definition of obsolete.
Results by Product Family

Updated many tables and deleted tables for obsolete products. Added new tables for CMOS device types XC4Vxxx, XC5Vxxx, and XC6Vxxx (Table 2-48 through Table 2-50).

Added a note to Table 2-21.

Board-Level Reliability Tests

Updated many tables and deleted tables for obsolete products containing data more than 2 years old. Deleted data for non-hermetic packages BG352, BG432, and BG560 (device types XCV1000E, XCV1600E, and XCV300).

Deleted data for package FB676 (device type XC7K410T). Deleted data for package SF363 (device type XC4VLX15). Deleted data for Pb-free packages BGG256 (device type XCS30XL), BGG352, BGG432, and BGG560 (device types XCV300E (Shrink), XCV600E (Shrink), and XCV1000E (Shrink)), CPG196 (device types XC6SLX4 and XC6SLX16), CPG236 (device type XC7A50T), FLG1155 (device type XC7V11580T), HCG1155 (device type XC7VH580T), and SFG363 (device type XC4VLX15).

Added a note to Table 3-2 and Table 3-23.

04/04/2017 Version 10.5.2
Table 2-15 XCVU440 equivalent device hours were corrected to be 34,592.
12/19/2016 Version 10.5.1
FFVB2104 Updated the plot.
10/31/2016 Version 10.5
Changed many tables to show test data for the first half of 2016. Added new product and package reliability data for XCVU440, XCVU190, XCVU125, XCVU095, and XCKU115 with respective packages of FFV1517, FFV1924, and FFV2104, FLV1517, FLV1924, and FLV2104 , FLG2104, FLG2377, and FLG2892. Removed the reliability data for these obsolete devices and packages: XCE06L24T, XC17SxxxA, XC17Vxxx, XCE0104, XC9572XL (PCG44 only), and PG120.
The Reliability Program

Changed the title of Table 1 to ESD and Latch-up Data for PROMs, CPLDs, and Older FPGAs. Added devices to Table 8. Changed nomenclature for degrees Kelvin to K. Updated Table 1. Updated Table 1 and Table 2 data for the 28nm and 20nm nodes. (The former Table 1-18, Beam Testing and Real-Time Soft Error Rates, was divided into two tables: Experimental Beam Testing and Real-Time Soft Error Rates for CRAM and Experimental Beam Testing and Real-Time Soft Error Rates for BRAM.)
Results by Product Family Updated Table 2-1, Summary of HTOL Test Results and many tables. Updated CPLD Products.
Board-Level Reliability Tests Updated tables for non-hermetic and hermetic packages. Added SFVA784 and SBVA784 to Pb-Free BGA.
04/01/2016 Version 10.4
Changed many tables to show test data for the second half of 2015.
The Reliability Program Updated Table 1 and Table 1‑18.
Results by Product Family Updated most of the tables in this chapter. Added a footnote to Table: THB Test Results for Si Gate CMOS Device Type UltraScale FPGAs. Added Table: High-Temperature Storage Life Test Results for Si Gate CMOS Device Type UltraScale FPGAs.
Board-Level Reliability Tests Updated Table 2: Summary of Test Results. Added FBVA900, FFVB2104, and FLVA1924 package types to Pb-Free BGA, Table 1.
09/08/2015 Version 10.3.1
Table 1‑18 Corrected two numbers in 20nm tech node row, FIT/Mb (Real-Time Soft Error Rate Per Event) column.
09/02/2015 Version 10.3
Changed many tables to show test data for the first half of 2015. No devices were removed. The UltraScale™ FPGA KU040 device was added. Test results for new package FFVA1156 were added. FFV1927 package details were added to Pb-Free BGA.
03/09/2015 Version 10.2.1
  Corrected typo in Table 1 and High-Temperature Operating Life (HTOL) Test from 1.43,104 to 1,143,104.
02/11/2015 Version 10.2
This report will now be issued biannually (twice a year). Changed many tables to show second quarter 2014 test data.
The Reliability Program Added UltraScale™ device data. Added Table 1-16: ESD and Latch-up Data for UltraScale Series.
Results by Product Family Added Table 2-27: THB Test Results for Si Gate CMOS Device Type XC2Vxxx. Deleted Table 2-29: THB Test Results for Si Gate CMOS Device Type XC2Sxxx. Deleted Table 2-39: TH Test Results for Si Gate CMOS Device Type XC3Sxxx. Deleted Table 2-40: TH Test Results for Si Gate CMOS Device Type XC3SxxxE. Deleted Table 2-41: TH Test Results for Si Gate CMOS Device Type XC3SxxxA. Deleted Table 2-42: TH Test Results for Si Gate CMOS Device Type XC3SDxxxA. Table 2-78: HASTU Test Results for Si Gate CMOS Device Type XC6Sxxx. Added Table 2-90: High-Temperature Storage Life Test Results for Si Gate CMOS Device Type XC6Sxxx. Table 2-91: High-Temperature Storage Life Test Results for Si Gate CMOS Device Type XC6Sxxx. Added Table 2-119: Summary of THB Test Results. Added Table 2-120: THB Test Results for Si Gate CMOS Device Type XC95xxxXL (replaced data for XC2Cxxx/A). Added Table 2-121: THB Test Results for Si Gate CMOS Device Type XC2Cxxx/A.
Board-Level Reliability Tests

Deleted package test results for PC44, PD8, and Table 3-29: Tests of Package Type DD8 (obsolete package).

Added package test results for BGG256, FFVA1156, CPG236, FLG1155, FGG400, and added Figure 3-14: Cycles to Failure in the Second-Level Reliability Tests for FFG1928.

08/07/2014 Version 10.1
Changed many tables to show second quarter 2014 test data.
The Reliability Program Updated Table 1 and Table 1. Updated SEU and Soft Error Rate Measurements.
Results by Product Family Data was updated in many tables. The Autoclave Test section was removed for CPLDs. HASTU has substituted Autoclave for the reliability monitor program.
Board-Level Reliability Tests Added packages for PQ208 and FBG484.
05/02/2014 Version 10.0
Changed many tables to show first quarter 2014 test data. Removed obsolete 0.22 µm Virtex® FPGA product data. Added package data for CLG400, FLG1926, FLG1928, and HCG1932. In Chapter 3, removed tables for packages CS280, CS484, FF1513, FF1517, PQ100, PQ160, PQ208, PQ240, CSG280, and PCG84. Added data for packages CLG400, FLG1926, FLG1928, and HCG1932. Added Appendix A: Additional Resources and Legal Notices.
03/18/2014 Version 9.8
  Replaced reliability data for package FFG1928. Added reliability data for package FLG1925. Revised the Revision History section for readability.
02/14/2014 Version 9.7
Changed many tables to show fourth quarter, 2013 test data. Removed reliability data for the obsolete XCSxxxXL 0.25 μm device. Removed Spartan®‑3 FPGA Autoclave data. HASTU has substituted Autoclave for the reliability monitor program.
The Reliability Program Updated Table 1, Table 7, Table 1, and Table 1‑18 Beam Testing and Real-Time Soft Error Rates.
Results by Product Family Updated and moved existing tables. Updated test results in Temperature Cycling Test, High Accelerated Stress Test, and High Temperature Storage Life. Updated test results in Temperature Humidity with Bias Test, Unbiased High Accelerated Stress Test, and Data Retention Bake Test.
Board-Level Reliability Tests Alphabetized Non-Hermetic packages SO20, VO20, VO48, PC44, PC84, PC20, PQ100, PQ160, PQ208, PQ240, TQ100, TQ144, VQ44, VQ100, HQ208, and HQ240. Removed package BGG256 from Reliability Data for Pb-Free Packages.
11/19/2013 Version 9.6
Changed many tables to show third quarter, 2013 test data. Removed reliability data for the obsolete XC95xxx 0.5 µm device. Removed Spartan‑3 FPGA Autoclave data. HASTU has substituted Autoclave for the reliability monitor program.
The Reliability Program Updated Table 1, Wafer Process Technology Family, Table 1, Product ESD and Latch-up Data, Table 7, ESD and Latch-up Data for 7 Series FPGAs and Zynq-7000 SoCs, Table 1, Summary of the Failure Rates, and Table 1‑18, Real-Time Soft Error Rates. Added devices XC7V2000T, XC7VH580T, XC7VX1140T, and XC7Z100 to Table 7.
Results by Product Family Deleted the Autoclave Test section in Temperature cycling Test.
Board-Level Reliability Tests

Added packages BG352, BG432, and BG560, FB676, FF484, FG320, FF900, BGG256, FBG900, FFG1513, FFG1517 FFG1696 FFG1704, FFG1738, FFG1759, FFG1738, FFG1760, FFV900, FFV901, FLG1925, FLG1926 FLG1928, FLG1932, FLG2104, FLG2377, FLG2892, and FLG48.

Added FBG900, SBG484, FFG1928 and their plots to Pb-Free BGA.

08/16/2013 Version 9.5
Changed many tables to show second quarter, 2013 test data. Removed reliability data for obsolete devices: XC17(S)xxx/XL/E 0.6 µm, XC4xxx/LE 0.5 µm, XC4xxxE 0.5 µm, XC4xxxXL 0.35 µm, XCSxxx 0.35 µm, XC4xxxXLA 0.25 µm, and XC95xxxXV 0.25 µm
The Reliability Program

Updated Table 1, Wafer Process Technology Family, Table 1, Product ESD and Latch-up Data, Table 9, ESD and Latch-up Data for XC2VPxxx, Table 1, Summary of the Failure Rates, and Table 1‑18, Real-Time Soft Error Rates.

Added XC7VX980T to Table 7, ESD and Latch-up Data for 7 Series FPGAs and Zynq-7000 SoCs.

Results by Product Family Deleted tables for obsolete devices. Updated data in many tables. Added Table 2‑23, THB Test Results for Si Gate CMOS Device Type XC3SxxxAN and Table 2‑86, THB Test Results for Si Gate CMOS Device Type XC17SxxxA.
Board-Level Reliability Tests

Deleted these tables:

Table 3‑24, Tests of Package Type DD8

Table 3‑25, Tests of Package Type Chip Scale CC44

Table 3‑61, Test Results for Device Types XC7VX485T, XC7VX690T under heading FFG1927.

Deleted PG132 and PG175 from Table 3-7, Tests of Package Type PG223. Deleted CB-100 and CB164 from and added CB196 to Table 3-8, Tests of Package Type CB228.

Updated data in many tables.

Added package CS484. Added packages FF1924, FF1926, FF1927, FF1928, FF1929, and FF1930. Added packages FFG1924, FFG1926, FFG1926, FFG1927, FFG1928, and FFG1930.

05/13/2013 Version 9.4
Changed many tables to show first quarter, 2013 test data.
The Reliability Program Added 7 series devices XC7VX330T, XC7VX415T, XC7VX550T, XC7VX690T and Zynq‑7000 SoC devices XC7Z010, XC7Z030, and XC7Z045 to Table 7, ESD and Latch-up Data for 7 Series FPGAs and Zynq-7000 SoCs. Updated data for 0.25 μm, 0.35 μm, and 0.5 μm process technologies in Table 1, Summary of the Failure Rates. Updated data for 40 nm, 45 nm, and 28 nm technology nodes in SEU and Soft Error Rate Measurements.
Results by Product Family Data in many tables was updated. Removed duplicate Table 2-17, HTOL Test Results for 0.15 µm Si Gate CMOS Device Type XCE2Vxxx. Deleted Table 2-69, Temperature Cycling Test Results for Si Gate CMOS Device Type XC4xxxXLA. Added Table 2‑67, Temperature Cycling Test Results for Si Gate CMOS Device Type XCE4VxXxxx.
Board-Level Reliability Tests Data in many tables was updated. Added packages and test results for FFV900, FFV901 and FFG1927.
04/02/2013 Version 9.3
Changed many tables to show fourth quarter, 2012 test data. Added Xilinx 7 series FPGAs and Zynq-7000 SoCs.
The Reliability Program Added XC7A100T, XC7A200T, XC7K70T, and XC7Z020 devices to Table 1‑15 ESD and Latch-up Data for 7 Series FPGAs. Failure rate data changed in Table 1‑16 Summary of the Failure Rates. Text and data changed in SEU and Soft Error Rate Measurements.
Results by Product Family

Data in many tables was updated. Added Table 2‑33 THB Test Results for Si Gate CMOS Device Type XCVxxx, Table 2‑35 THB Test Results for Si Gate CMOS Device Type XC2Vxxx, Table 2‑32 THB Test Results for Si Gate CMOS Device Type XC2SxxxE, Table 2‑81 HAST Test Results for Si Gate CMOS Device Type XC4xxxE, and Table 2‑104 HASTU Test Results for Si Gate CMOS Device Type XC4xxxXLA.

Deleted Table 2-167, Summary of the Test Results for device XC2Cxxx/A from Temperature Humidity Test, page 68.

Board-Level Reliability Tests

Data in many tables was updated. Added packages CS144, CS324, CLG400 and CLG484, FBV676 and their respective test results in Table 3‑9 Test Results for Device Types XCV50, XC2V80, Table 3‑11 Test Results for Device Types XC6SLX45, XC6SLX45T, Table 3‑29 Test Results for Device Types XC2V1000, XC2V1500, and Table 3‑49 Test Results for Device Types XC5VLX50.

Note: Table numbers are accurate as of the version 9.3 printing.

02/12/2013 Version 9.2
Changed many tables to show the third quarter, 2012 test data. Added Xilinx 7 series FPGAs.
The Reliability Program Added XC7K160T, XC7K410T, XC7K420T, XC7K480T, XC7V585T, and XC7VX485T devices to Table 1‑15, ESD and Latch-up Data for 7 Series FPGAs.
Results by Product Family Added Table 2‑34, THB Test Results for Si Gate CMOS Device Type XCVxxxE, Table 2‑95, HAST Test Results for Si Gate CMOS Device Type XCVxxxE, Table 2‑103, HASTU Test Results for Si Gate CMOS Device Type XC4xxxE, Table 2‑110, HASTU Test Results for Si Gate CMOS Device Type XCVxxxE, Table 2‑111, HASTU Test Results for Si Gate CMOS Device Type XCVxxxE (Shrink), Table 2‑120, HASTU Test Results for Si Gate CMOS Device Type XCE4VxXxxx, Table 2‑125, High-Temperature Storage Life Test Results for Si Gate CMOS Device Type XC4xxxXLA, Table 2‑126, High-Temperature Storage Life Test Results for Si Gate CMOS Device Type XCSxxx, Table 2‑141, High-Temperature Storage Life Test Results for Si Gate CMOS Device Type XCE4VxXxxx, and Table 2‑160, Autoclave Test Results for Si Gate CMOS Device Type XCFxxxS/P.
Board-Level Reliability Tests

Added packages FF665, FF672, FF676, FFG665, FFG672, and FFG896. Added Table 3‑47, Test Results for Device Types XC5VLX30T and Table 3‑56, Test Results for Device Type XC2V1000.

Note: Table numbers are accurate as of the version 9.2 printing.

08/22/2012 Version 9.1
Changed many tables to show the second quarter, 2012 test data.
The Reliability Program

Added entries for devices XC6SLX4 and XC6SLX9.

Removed obsolete reliability data for devices XC4VSX25, XC4VSX55, and XCV600E.

Results by Product Family

Added entries for devices XC17S150A, XC3S250E, XC6VLX195T, XC7K410T, XC7VX485T, and XC9536.

Removed obsolete reliability data for the following devices:

XC17(S)xxx, XC17(S)xxx(X)L, XC17(S)xxxE, XC1702L, XC17S15A, XC17S200A, XC17S50XL, XC17Sxxx, XC17SxxxA, XC17SxxxXL, XC17Vxxx, XC18V01, XC18V02, XC18V04, XC18V512, XC18Vxxx, XC2C64, XC2S100E, XC2S150E, XC2V1500, XC2V3000, XC2VP100, XC2VP70, XC2VPxxx, XC2Vxxx, XC3S1000, XC3S100E, XC3S1400AN, XC3S200A, XC3SD1800A, XC3SDxxxA, XC3SxxxA, XC3SxxxAN, XC4013XLA, XC4VLX15, XC4VLX200, XC4VLX80, XC4VSX25, XC4VSX55, XC4xxxXLA, XC5VLX50T, XC6SLX150T, XC6SLX45, XC6SLX45T, XC6VLX130T, XC6VLX760, XC95144XL, XC95144XV, XC95288XV, XC95xxxXL, XC95xxxXV, XCF01S, XCF04S, XCF08P, XCF16P, XCF32P, XCFxxx, XCFxxxP, XCFxxxS, XCS20, XCS40XL, XCSxxx, XCSxxxXL, XCV1000E, XCV1600E, XCV400, XCV400E, XCV405E, XCV600E, XCV812E, XCVxxx (shrink), XCVxxxE, XCVxxxE (shrink)

Board-Level Reliability Tests

Added entries for devices XC7K410T and XC7VX485T.

Removed obsolete reliability data for the following devices:

XC17256E, XC17S100A, XC17S100XL, XC17S200A, XC17S50A, XC18V01, XC2C128, XC2C256, XC2S300E, XC2V1000, XC2V250, XC2V500, XC2V6000, XC2V80, XC2VP100, XC2VP50, XC2VP70, XC3S1500, XC3S4000, XC3S5000, XC4085XLA, XC4VLX100, XC4VLX25, XC5215, XC5VLX50, XC6SLX150T, XC6SLX16, XC6SLX45, XC6SLX45T, XC6VLX130T, XC6VLX240T, XC6VLX475T, XC6VLX760, XCE2VP50, XCF01S, XCF02S, XCF04S, XCF08P, XCF16P, XCF32P, XCR3064XL, XCS40XL, XCV1000E (shrink), XCV1600E, XCV2000E, XCV2000E (shrink), XCV300E (shrink), XCV600, XCV600E

05/08/2012 Version 9.0
  Changed many tables to show the first quarter, 2012 test data. Added Xilinx 7 series FPGAs.
01/27/2012 Version 8.1
The Reliability Program Added XCE6VxXxxx to Table 1‑7. Added XC5VSX240T to Table 1‑12.
Results by Product Family

Added XCE6VxXxxx to Table 2‑1. Deleted XC2S150 from Table 2‑8. Added XCV100 to Table 2‑9. Added XC6SLX45 and XC6SLX100 to and deleted XC6SLX16 from Table 2‑23. Added XC4VLX160 and XC4VFX12 and modified Note 1 in Table 2‑24. Added Note 1 to Table 2‑25 and Table 2‑26. Inserted new table: Table 2‑29. Added XC5VLX85T to table Table 2‑45. Added XC6VLX365T to Table 2‑46. Added XCS20XL to and deleted XCS10XL from Table 2‑71. Added XC3S200AN to Table 2‑84. Added XC6SLX4 to Table 2‑85. Added XC2S100E to and deleted XC2S400E from Table 2‑93. Added XCS20XL and XCSxxxX to Table 2‑105. Added XC6SLX4 and XC6SLX9 to Table 2‑117. Deleted XCR3064XL from Table 2‑178. Added XC2C64 to Table 2‑194. Added XCR3128XL to Table 2‑214. Added XC2C64 to Table 2‑215.

Board-Level Reliability Tests

Added HTS to Table 3‑3 and Table 3‑47. Added HAST to Table 3‑56.

Note: Table numbers are accurate as of the version 8.1 printing.

11/07/2011 Version 8.0
Changed most tables to show the third quarter, 2011 test data.
The Reliability Program Updated Acceptance Criteria and added note 3 to Table 1‑3.
Results by Product Family

Added XCV600E to Table 2‑12. Added XC2VP7 to and deleted XC2VP80 from Table 2‑15. Deleted XC3S2000 from Table 2‑18. Deleted XC4VLX15 from Table 2‑24. Added XC6VLX130T to Table 2‑28. Added XC4VLX80 to Table 2‑43. Added XC2V6000 to Table 2‑77. Deleted XC4VFX100 and XC4VLX85T from Table 2‑85. Added XC5VLX330T device to Table 2‑86. Added XC6VLX195T device to Table 2‑87. Added XC6SLX25T to Table 2‑99. Added XCV100 to Table 2‑123. Added XC6SLX16 to Table 2‑136. Added XC4VLX80 to Table 2‑137. Deleted XC17S150XL from Table 2‑146. Deleted XCF128X from Table 2‑148. Deleted XC17S30XL from Table 2‑152. Deleted XCF01S, XCF04S, XCF08P, and XCF128X from Table 2‑155. Deleted XC17S30XL from Table 2‑163. Deleted XC17V16 from Table 2‑164. Deleted XC17S30XL from Table 2‑169. Deleted XC17V16 from Table 2‑170. Deleted XCF01S, XCF04S, XCF08P, and XCF128X from Table 2‑172. Deleted XC95216 from Table 2‑174. Added XCR3256XL and deleted XCR384XL and XCR3512XL from Table 2‑192. Added XCR3256XL and deleted XCR384XL and XCR3512XL from Table 2‑201. Added XCR3256XL and deleted XCR3128XL XCR3512XL from Table 2‑213.

Board-Level Reliability Tests

Added HASTU to Table 3‑11. Deleted HTS from Table 3‑12. Deleted HASTU from Table 3‑15. Deleted Temperature cycling –40 to +125°C row from Table 3‑26. Added HASTU to Table 3‑29. Added HTS to Table 3‑43. Added HAST to Table 3‑47. Added Temperature cycling ‑55 to +125°C row and HTS to Table 3‑49. Added HTS to Table 3‑66. Added Temperature humidity 85°C, 85% RH with bias row to Table 3‑74.

Note: Table numbers are accurate as of the version 8.0 printing.

08/02/2011 Version 7.0
Changed most tables to show the second quarter, 2011 test data.
06/17/2011 Version 6.0.1
Revised last sentence in SEU and Soft Error Rate Measurements for clarity.
05/09/2011 Version 6.0
Changed most tables to show the first quarter, 2011 test data.
02/01/2011 Version 5.12
Changed most tables to show the fourth quarter, 2010 test data.
11/01/2010 Version 5.11
Changed most tables to show the third quarter, 2010 test data.
08/10/2010 Version 5.10
Changed most tables to show the second quarter, 2010 test data.
05/04/2010 Version 5.9
Changed most tables to show the first quarter, 2010 test data.
03/15/2010 Version 5.8
Changed most tables to show the fourth quarter, 2009 test data.
10/27/2009 Version 5.7

Updated most tables to include third quarter, 2009 test data. Added alpha particle FIT/Mb data for Spartan®-6 and Virtex®-6 FPGAs to Table 1‑14, page 19.

Note: Table number is accurate as of the version 5.7 printing.

08/03/2009 Version 5.6
Changed most tables to show the second quarter, 2009 test data.
06/15/2009 Version 5.5

Added SF363 (Lot 2) data to Table 3-62, page 102. Replaced Figure 3‑1, page 103, Figure 3‑2, page 103, and Figure 3‑3, page 104. Revised FFG1704 data in Table 3‑64, page 108.

Note: Table and Figure numbers are accurate as of the version 5.5 printing.

05/07/2009 Version 5.4
Changed most tables to show the first quarter, 2009 test data. Added second paragraph to SEU and Soft Error Rate Measurements.
02/11/2009 Version 5.3

Changed most tables to show the fourth quarter test data. Added single event upset and soft error rate data. See Table 1-14, page 19.

Note: Table number is accurate as of the version 5.3 printing.

11/14/2008 Version 5.1
Changed most tables to show the third quarter test data. Updated legal disclaimer.
08/15/2008 Version 5.0
Changed most tables to show the second quarter test data.
07/07/2008 Version 4.3
Changed most tables to show the first quarter test data.
02/06/2008 Version 4.2
Changed most tables to show the fourth quarter test data.
10/31/2007 Version 4.1.2
Changed most tables to show the third quarter test data.
09/18/2007 Version 4.1.1
Corrected omission in this history table.
08/24/2007 Version 4.1
Changed most tables to show the second quarter test data.
06/04/2007 Version 4.0
Changed most tables to show the first quarter test data.
03/28/2007 Version 3.3.2
Corrected typos in four tables.
02/20/2007 Version 3.3.1
Corrected typos in three tables.
02/12/2007 Version 3.3
Changed most tables to show the fourth quarter test data.
12/01/2006 Version 3.2
Changed most tables to show the third quarter test data.
10/06/2006 Version 3.1.2
Corrected values in tables 1-12, 2-87, 2-90, and 2-91.
08/29/2006 Version 3.1.1
Changed typos in tables 2-91, 3-44, and 3-55.
08/11/2006 Version 3.1
Changed most tables to show the second quarter test data.
06/20/2006 Version 3.0.1
Corrected two transposed figures in Table 1-10.
05/05/2006 Version 3.0
Changed most tables to show the first quarter test data.
02/24/2006 Version 2.9
Updated most tables to reflect the fourth quarter test data.
11/17/2005 Version 2.8
Updated most tables to include the third quarter test data.
08/19/2005 Version 2.7
Changed most tables to show the second quarter test values.
05/20/2005 Version 2.6
Corrected data in tables 2-61 and 3-32.
03/01/2005 Version 2.5
Changed most tables to show the fourth quarter test values. Removed packaging information from Chapter 1 and added a reference to the packaging website.
01/04/2005 Version 2.4
Added third quarter data.
08/18/2004 Version 2.3
Added second quarter data.
05/24/2004 Version 2.2
Changed Tables 1-1, 2-1, 2-15, 3-44, 3-46, 3-48, 3-50, 3-52 and a heading on page 75.
05/24/2004 Version 2.1
Changed FIT rate on page 7 for 0.5 μm from 89 to 8.
05/10/2004 Version 2.0
First quarter 2004 revision.
02/09/2004 Version 1.0
Initial release in new template. N/A