FGG676, FFG1152, FBVA900, FFVB2104, FLVA1924, SFVA784, and SBVA784

Device Reliability Report (UG116)

Document ID
UG116
Release Date
2023-05-17
Revision
10.17 English
Table 1. Package Details (All Dimensions in mm)
Package Size I/O Pitch Ball/ Column Size Pad Opening Pad Type Die Size Substrate
FGG676 27 x 27 676 1.00 0.60 0.46 SMD 17.8 x 17.8 x 0.3 0.56 thick, 4-layer
FFG1704 42.5 x 42.5 1,704 1.00 0.60 0.53 SMD 23 x 23 1.152 thick, 6-layer
FFG1152 35 x 35 1,152 1.00 0.60 0.53 SMD 22 x 20 x 0.7 1.152 thick, 6-layer
FBVA900 31 x 31 900 1.00 0.60 0.53 SMD 16.30 x 11.36 1.24 thick, 10-layer
FFVB2104 47.5 x 47.5 2104 1.00 0.6 0.53 SMD 18 x 22.5 1.42 thick, 14-layer
FLVA1924 45 x 45 1924 1.00 0.6 0.53 SMD 25 x 31 1.33 thick, 12-layer

Mother Board Design and Assembly Details

  • 8-layer, FR-4, 220 x 140 x 2.3622 mm size, OSP finish
  • 0.5 mm pad diameter/0.65 mm solder mask opening (NSMD pads)
  • Board layer structure: signal/GND/signal/power/signal/GND/signal/power
  • Power, GND layer has 70% metal. Internal signal layer has 40% metal.
  • 0.1524 mm laser cut stencil, 0.50 mm aperture, alpha metals WS609 paste

Test Condition

  • FGG676: 0°C – 100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate
  • FFG1152: 0°C – 100°C, 10-minute dwells, 5-minute ramps, 2 cycles/hour

Failure Criteria

  • Continuous scanning of daisy chain nets (every 2 minutes)
  • OPEN: Resistance of net > threshold resistance (300Ω)
  • FAIL: At least 2 opens within one cycle, log 15 failures for each net
Table 2. Summary of Test Results
Package Cycles Completed Number Tested Number Failed First Failure (Cycle) Characteristic Life (Cycle)
FGG676 7,027 35 27 4,390 5,974
FFG1704 5,000 32 0 NA NA
FFG1152 4,640 28 26 3,186 4,121
FBVA900 8,737 32 28 7,181 8,260
FFVB2104 8,568 32 14 5,205 9,351
FLVA1924 4,605 32 25 2,759 4,222

Weibull Plots

Figure 1. Cycles to Failure in the Second-Level Reliability Tests for FGG676
Figure 2. Cycles to Failure in the Second-Level Reliability Tests for FFG1152