Xilinx® documentation is organized around a set of standard design processes to help you find relevant content for your current development task. All Versal® ACAP design process Design Hubs and the Design Flow Assistant materials can be found on the Xilinx.com website. This document covers the following design processes:
- System and Solution Planning
Identifying the components, performance, I/O, and
data transfer requirements at a system level.
Includes application mapping for the solution to PS,
PL, and AI Engine.
The technical reference manual (TRM) describes the overall hardware architecture of the Versal® ACAP and provides details on the blocks in the platform management controller (PMC) and in the processing system (PS). The PS includes the real-time processing unit (RPU), application processing unit (APU), and their peripherals.
- Device-level block diagram: Device Overview chapter
- High-level Interconnect Diagrams chapter
- PMC and PS Architectures chapter
- PL Fabric Overview chapter
- Device I/O Connectivity chapter with I/O buffers and transceivers
- Clocks, Resets, and Power chapter with architectures and controls
There are several device families with different device options. The availability of a specific device option is listed in the Versal Architecture and Product Data Sheet: Overview (DS950). The TRM usually identifies these with the designation: device option.
- Embedded Software Development
Creating the software platform from the hardware
platform and developing the application code using
the embedded CPU. Also covers XRT and Graph
Embedded software runs in the RPU and APU scalar engines in the PS. Arm® Cortex® :
- Real-time Processing Unit: dual-core Cortex-R5F with lock-step option
- Application Processing Unit: dual-core Cortex-A72
The system software boot up and operating system environments are described in the Versal ACAP System Software Developers Guide (UG1304). The PMC modules are described in the Embedded Processor, Configuration, and Security Units section.
- Board System Design
Designing a PCB through schematics and board
layout. Also involves power, thermal, and signal
The TRM includes some important information to help with board design planning and development:
- Boot device interfaces: Boot Modes
- Pin planning for I/O peripherals: Multiplexed I/O Signals and Pins
- Power controls: Power Diagram
- JTAG interface: JTAG and Boundary-Scan
For package and pin information, see the Versal ACAP Packaging and Pinouts Architecture Manual (AM013).
The electrical specifications are provided in the Versal Prime Series Data Sheet: DC and AC Switching Characteristics (DS956) and the Versal AI Core Series Data Sheet: DC and AC Switching Characteristics (DS957).