SSI High-Bandwidth Memory Package Concept

Versal Adaptive SoC Technical Reference Manual (AM011)

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1.6 English

The HBM devices are constructed using a silicon interposer die that connects to the HBM controller to the stack of HBM memory die and device substrate. The devices with HBM interface support are listed in the Versal Architecture and Product Data Sheet: Overview (DS950).

Figure 1. High-bandwidth Memory SoC Package Concept