Si Interposer Design for High-bandwidth Memory

Versal ACAP Technical Reference Manual (AM011)

Document ID
AM011
Release Date
2022-04-26
Revision
1.4 English

The high-bandwidth memory (HBM) devices are constructed using a silicon interposer die that connects to the HBM controller to the stack of memory die.

Figure 1. High-bandwidth Memory Device Physical Representation