Component Pick-up Tool Consideration

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

For pick and place machines to place lidless and bare-die flip-chip BGAs onto PCBs, Xilinx recommends using soft tips or suction cups for the nozzles. This prevents chipping, scratching, or even cracking of the bare die.

Figure 1. Recommended Method For Using Pick-up Tools