Conformal Coating

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

Xilinx does not have information regarding the reliability of flip-chip BGA packages on a board after exposure to any specific conformal coating process. Therefore, any process using conformal coating should be qualified for the specific use case to cover the materials and process steps.

Ruggedized XQ packages are designed to support conformal coating, with vented lids that ensure proper cleaning can occur after the etching process and prior to conformal coating.

Recommended: When a conformal coating is required, Parylene-based material should be used to avoid potential risk of weakening the lid adhesive used in Xilinx packages.