Device/Package Combinations

Versal Adaptive SoC Packaging and Pinouts Architecture Manual (AM013)

Document ID

AM013

Release Date

2023-03-23

Revision

1.3 English

The following table shows the size and BGA pitch of the Versal device packages. All packages are available with eutectic-SnPb BGA balls. For these packages, the Pb-free signifier in the package name is a Q.

Table 1. Package Specifications
BGA Packages	Description	Package Specifications
BGA Packages	Description	Pitch (mm)	Size (mm)	LSC Ball Grid Size (balls)
SBVA484	Super-fine pitch bare die	0.80	19 × 19	–
SBVA625	Super-fine pitch bare die	0.80	21 × 21	–
SFVA784	Super-fine pitch with forged lid	0.80	23 × 23	–
NBVA1024	Fine pitch bare-die	0.92	31 × 31	–
NBVB1024	Fine pitch bare-die	0.92	31 × 31	–
NFVB1369	Fine pitch with forged lid	0.92	35 × 35	–
NSVC1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
NSVD1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
NSVE1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
NSVF1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
NSVG1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
NSVH1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
NSVI1369	Fine pitch lidless with stiffener ring	0.92	35 × 35	–
VFVC1596	Fine pitch with forged lid	0.92	37.5 × 37.5	6 × 6
VIVA1596	Overhang fine pitch lidless with stiffener ring	0.92	40 × 40	6 × 6
VIRA1596	Ruggedized overhang fine pitch lidless with stiffener ring	0.92	40 × 40	6 × 6
VSVA1596	Fine pitch lidless with stiffener ring	0.92	37.5 × 37.5	–
VFVC1760	Fine pitch with forged lid	0.92	40 × 40	6 × 6
VFVF1760	Fine pitch with forged lid	0.92	40 × 40	6 × 6
VFVG1760	Fine pitch lidless with stiffener ring	0.92	40 × 40	6 × 6
VSVD1760	Fine pitch lidless with stiffener ring	0.92	40 × 40	6 × 6
VSVH1760	Fine pitch with forged lid	0.92	40 × 40	6 × 6
VSVI1760	Fine pitch with forged lid	0.92	40 × 40	6 × 6
VSRD1760	Ruggedized fine pitch lidless with stiffener ring	0.92	40 × 40	6 × 6
VSVA2021	Fine pitch lidless with stiffener ring	0.92	42.5 x 42.5	7 × 7
VSVB2021	Fine pitch lidless with stiffener ring	0.92	42.5 x 42.5	7 × 7
VSVC2021	Fine pitch lidless with stiffener ring	0.92	42.5 x 42.5	7 × 7
VSVA2197	Fine pitch lidless with stiffener ring	0.92	45 × 45	7 × 7
VSRA2197	Ruggedized fine pitch lidless with stiffener ring	0.92	45 × 45	7 × 7
VSVB2197	Fine pitch lidless with stiffener ring	0.92	45 × 45	7 × 7
VSVD2197	Fine pitch lidless with stiffener ring	0.92	45 × 45	7 × 7
VSVA2785	Fine pitch lidless with stiffener ring	0.92	50 × 50	7 × 7
VSVA3340	Fine pitch lidless with stiffener ring	0.92	55 × 55	10 × 10
VSVB3340	Fine pitch lidless with stiffener ring	0.92	55 × 55	10 × 10
VSVA3697	Fine pitch lidless with stiffener ring	0.92	57.5 x 57.5	11 x 11
LSVC4072	Fine pitch lidless with stiffener ring	1.00	65 × 65	10 × 10
LSVA4737	Fine pitch lidless with stiffener ring	1.00	70 × 70	13 × 13
LSVB4737	Fine pitch lidless with stiffener ring	1.00	70 × 70	13 × 13
VSVA5601	Fine pitch lidless with stiffener ring	0.92	70 x 70	11 x 15
VSVA6865	Fine pitch lidless with stiffener ring	0.92	77.5 x 77.5	19 x 16

Important: Packages with land-side capacitors (LSC) include a region of the BGA matrix where the BGA balls are replaced with capacitors. The LSC Ball Grid Size column in Table 1 describes the size of the LSC region in terms of the number of BGA balls replaced by capacitors. Therefore, packages with LSCs have fewer balls than the package name implies (for example, the VSVA2197 has 7 x 7 = 49 fewer balls than the implied 2197 balls).