Device/Package Combinations

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

The following table shows the size and BGA pitch of the Versal device packages. All packages are available with eutectic BGA balls. For these packages, the Pb-free signifier in the package name is a Q.

Table 1. Package Specifications
Packages Description Package Specifications
Package Type Pitch (mm) Size (mm) LSC Ball Grid Size (balls)
SFVB625 Super-fine pitch with forged lid BGA 0.8 21 × 21
VBVA1024 Fine pitch bare-die 0.92 31 × 31 4 × 4
VFVB1024 Fine pitch with forged lid 31 × 31 4 × 4
VFVB1369 Fine pitch with forged lid 35 × 35 5 × 5
VSVE1369 Fine pitch lidless with stiffener ring 35 × 35 5 × 5
VSVA1596 Fine pitch lidless with stiffener ring 37.5 × 37.5 5 × 5
VIVA1596 Overhang fine pitch lidless with stiffener ring 40 × 40 6 × 6
VFVA1760 Fine pitch with forged lid 40 × 40 6 × 6
VFVC1760 Fine pitch with forged lid 40 × 40 6 × 6
VSVD1760 Fine pitch lidless with stiffener ring 40 × 40 6 × 6
VSVA2197 Fine pitch lidless with stiffener ring 45 × 45 7 × 7
VSVA2785 Fine pitch lidless with stiffener ring 50 × 50 9 × 9
Important: Packages with land-side capacitors (LSC) include a region of the BGA matrix where the BGA balls are replaced with capacitors. The LSC Ball Grid Size column in Table 1 describes the size of the LSC region in terms of the number of BGA balls replaced by capacitors. Therefore, packages with LSCs have fewer balls than the package name implies (for example, the VSVA2197 has 7 x 7 = 49 fewer balls than the implied 2197 balls).