Edge Bond Removal

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

Edge bond material can be removed by heating to 170–180°C, and scraping using a stiff probe made of stable organic material such as a non-resinous wood or Teflon. Use a hot air blower on the edge bond area and slowly remove the edge bond adhesive from side to side. Do not use force to remove the edge bond adhesive. Excess adhesive on the PCB can be removed using a chisel-tip soldering iron, with sufficient precautions to limit damage to the PCB surface.

Xilinx has successfully evaluated the application processes used by Flex and Celestica and recommends these contract manufacturers for edge bond assembly of Xilinx packages.