Edge Bonding Guidelines

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

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1.0 English

The edge bonding technique uses high-adhesion adhesives dispensed along the periphery of a component, as shown in the following figure. Xilinx recommends edge bonding larger packages (55 mm x 55 mm or larger) for increased mechanical reliability.

Figure 1. Edge Bonded BGA Packages