Edge Bonding Guidelines

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

The edge bonding technique uses high-adhesion adhesives dispensed along the periphery of a component, as shown in the following figure. Xilinx recommends edge bonding larger packages (55 mm x 55 mm or larger) for increased mechanical reliability.

Figure 1. Edge Bonded BGA Packages