Instructions for Removal of Phase-change Material
- Separate the Components
At room temperature, if possible, use a back and forth twisting motion to break the bond between the phase-change thermal interface material and mated components (i.e., heat sink and Versal device). See the following figure.Figure 1. Breaking the Bond between Thermal Interface Material and Mated Components
For smaller components (typically 15 mm x 15 mm or less), the bond usually breaks free easily at room temperature. For larger components, in situations where minimal movement is available, or if using fragile components, heat the component (preferred) or heat sink to about 40°C–60°C before removal.
The guideline is 40°C–60°C, however, you might find that for your application, heating to 35°C is adequate. You might prefer to heat to 70°C which makes the phase-change thermal interface material very soft and the components can be easily separated.
- Scrape Away Thick Residue
For a faster clean-up once components are separated, scrape away any large residual material amounts with a plastic spatula or a wooden tongue depressor. A clean dry rag can be used to wipe away excess material.
- Clean Remaining Residue with Solvent
Using a clean cloth/wipe, wet it with your choice of solvent (see the following list) and wipe away any remaining residue.
- Toluene (easiest)
- Acetone (very good)
- Isoparaffinic hydrocarbon: Isopar, Soltrol (trade names) (very good)
- Isopropyl alcohol (OK)
- Working with Laird Material
Safe handling, disposal, and first-aid measures for working with phase-change material are included in the Laird Technologies material safety data sheet (MSDS). Read the MSDS before using or handling. See the Laird Technologies, Inc. website.