This chapter provides mechanical drawings (package specifications) of the Versal™ ACAPs. The following table is a cross-reference to the mechanical drawings by device and package combination. See Package Specifications Designations for definitions of Evaluation Only, Engineering Sample, and Production mechanical drawings.
Important: All
packages are available with eutectic BGA balls. To order these packages, the device
type starts with an XQ vs. XC or XA, and the Pb-free signifier in the package name
is Q. For the mechanical drawings, refer to the Pb-free version of these
packages.
See the Table 3 table for details on key dimensions/tolerances shown in each mechanical drawing.
Package | Devices | ||||
---|---|---|---|---|---|
VC1352 | VC1502 | VC1702 | VC1802 | VC1902 | |
VBVA1024 | |||||
VSVE1369 | |||||
VSVG1369 | |||||
VSVA1596 | |||||
VIVA1596 |
Figure 1
Engineering Sample |
Figure 1
Engineering Sample |
|||
VSVD1760 |
Figure 1
Engineering Sample |
Figure 1
Engineering Sample |
|||
VSVA2197 |
Figure 1
Engineering Sample |
Figure 1
Engineering Sample |
Package | Devices | |||||||
---|---|---|---|---|---|---|---|---|
VM1102 | VM1302 | VM1402 | VM1502 | VM1802 | VM2502 | VM2602 | VM2902 | |
SFVB625 | ||||||||
VFVB1024 | ||||||||
VFVB1369 | ||||||||
VFVF1369 | ||||||||
VFVA1760 | ||||||||
VFVC1760 |
Figure 1
Engineering Sample |
|||||||
VSVD1760 |
Figure 1
Engineering Sample |
|||||||
VSVA2197 |
Figure 1
Engineering Sample |
Dimension | Definition |
---|---|
|
Bilateral tolerance of package sides with respect to datums A and B |
|
Flatness tolerance of silicon die or package lid top surface |
/ / | Bilateral tolerance for parallelism of silicon die or package lid top surface with respect to the seating plane datum C |
A | Thickness of package with respect to the seating plane datum C |
A1 | Thickness of BGA balls with respect to the seating plane datum C |
A2 | Thickness of package body, including stiffener ring or lid and excluding BGA balls, with respect to the seating plane datum C |
A3 | Distance from top of silicon die to top of stiffener ring or lid with respect to the seating plane datum C |
D/E | Length/width of package with respect to datums A and B |
D1/E1 | Length/width of BGA matrix with respect to datums A and B |
e | BGA ball pitch measured at the center of each ball |
øb | BGA ball diameter |
|
Unidirectional upward tolerance with respect to the seating plane datum C |
/ / bbb | Bilateral tolerance for parallelism of package surface with respect to the seating plane datum C |
øddd | BGA ball position tolerance of diameter ddd with respect to datums A and B perpendicular to the seating plane datum C in which the center of each ball must lie |
øeee | BGA ball position tolerance of diameter eee measured with respect to other balls within the BGA matrix in which the center of each ball must lie |
M | BGA ball matrix size |