Mechanical Drawings

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)
Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

This chapter provides mechanical drawings (package specifications) of the Versal™ ACAPs. The following table is a cross-reference to the mechanical drawings by device and package combination. See Package Specifications Designations for definitions of Evaluation Only, Engineering Sample, and Production mechanical drawings.

Important: All packages are available with eutectic BGA balls. To order these packages, the device type starts with an XQ vs. XC or XA, and the Pb-free signifier in the package name is Q. For the mechanical drawings, refer to the Pb-free version of these packages.

See the Table 3 table for details on key dimensions/tolerances shown in each mechanical drawing.

Table 1. Cross-Reference to Versal ACAP AI Core Series Mechanical Drawings by Package
Package Devices
VC1352 VC1502 VC1702 VC1802 VC1902
VBVA1024      
VSVE1369      
VSVG1369        
VSVA1596      
VIVA1596       Figure 1

Engineering Sample

 Figure 1

Engineering Sample
VSVD1760       Figure 1

Engineering Sample

 Figure 1

Engineering Sample
VSVA2197     Figure 1

Engineering Sample

 Figure 1

Engineering Sample
Table 2. Cross-Reference to Versal ACAP Prime Series Mechanical Drawings by Package
Package Devices
VM1102 VM1302 VM1402 VM1502 VM1802 VM2502 VM2602 VM2902
SFVB625              
VFVB1024          
VFVB1369          
VFVF1369            
VFVA1760          
VFVC1760       Figure 1

Engineering Sample

  
VSVD1760         Figure 1

Engineering Sample

      
VSVA2197         Figure 1

Engineering Sample

    
Table 3. Mechanical Drawing Dimension Definitions
Dimension Definition
Bilateral tolerance of package sides with respect to datums A and B
Flatness tolerance of silicon die or package lid top surface
/ / Bilateral tolerance for parallelism of silicon die or package lid top surface with respect to the seating plane datum C
A Thickness of package with respect to the seating plane datum C
A1 Thickness of BGA balls with respect to the seating plane datum C
A2 Thickness of package body, including stiffener ring or lid and excluding BGA balls, with respect to the seating plane datum C
A3 Distance from top of silicon die to top of stiffener ring or lid with respect to the seating plane datum C
D/E Length/width of package with respect to datums A and B
D1/E1 Length/width of BGA matrix with respect to datums A and B
e BGA ball pitch measured at the center of each ball
øb BGA ball diameter
aaa Unidirectional upward tolerance with respect to the seating plane datum C
/ / bbb Bilateral tolerance for parallelism of package surface with respect to the seating plane datum C
øddd BGA ball position tolerance of diameter ddd with respect to datums A and B perpendicular to the seating plane datum C in which the center of each ball must lie
øeee BGA ball position tolerance of diameter eee measured with respect to other balls within the BGA matrix in which the center of each ball must lie
M BGA ball matrix size