AMD Adaptive Computing documentation is organized around a set of standard design processes to help you find relevant content for your current development task. You can access the AMD Versal™ adaptive SoC design processes on the Design Hubs page. You can also use the Design Flow Assistant to better understand the design flows and find content that is specific to your intended design needs.
- System and Solution Planning
- Identifying the components, performance, I/O, and data transfer requirements at a system level. Includes application mapping for the solution to PS, PL, and AI Engine. Topics in this document that apply to this design process include:
- Board System Design
-
Designing a PCB through schematics and board
layout. Also involves power, thermal, and signal
integrity considerations. Topics in this document that
apply to this design process include:
- Overview describes the architecture, package resources, and footprint compatibility between packages.
- Device Diagrams Overview, Package Files, and Pin Maps describes the package pinouts in textual and graphical format.
- Mechanical Drawings includes the physical dimensions for each package.
- Package Marking and Packing and Shipping.
- Soldering Guidelines, Recommended PCB Design Rules for BGA, and Edge Bonding Guidelines provide PCB implementation information.
- Thermal Specifications, Thermal Management Strategy, Heat Sink Guidelines for Bare-die VB Packages, and Mechanical and Thermal Design Guidelines for Lidless Flip-chip Packages include guidelines for overall thermal management.