Package specifications are designated as evaluation only, engineering sample, or production. Each designation is defined as follows.
These package specifications are based on initial device specifications, package routability analysis and mechanical package construction. Package specifications with this designation are not stable and package pinouts are likely to change and these specifications should only be used for initial system level design feasibility.
These package specifications are based on a released package design and validated with ES engineering sample (ES) devices. Package specifications with this designation are considered stable, however some pinout and mechanical specifications might change prior to the production release of the particular device. Package pinouts with this designation are to be used for PCB and AMD Vivado™ designs using ES devices.
These package specifications are released coincident with production release of a particular device. Customers receive formal notification of any subsequent changes.