Versal™ devices are packed in trays. Trays are used to pack most of Xilinx surface-mount devices because they provide excellent protection from mechanical damage. In addition, they are manufactured using antistatic material to provide limited protection against ESD damage and can withstand a bake temperature of 125°C.
| Package | Maximum Number of Devices Per Tray | Maximum Number of Units In One Internal Box |
|---|---|---|
| SFVB625 | 60 | 300 |
| VBVA1024 | ||
| VFVB1024 | ||
| VFVB1369 | ||
| VSVE1369 | ||
| VSVA1596 | ||
| VIVA1596 | 12 | 36 |
| VFVA1760 | 12 | 36 |
| VFVC1760 | 12 | 36 |
| VSVD1760 | 12 | 36 |
| VSVA2197 | 12 | 36 |
Important: All
packages are available with eutectic BGA balls. To order these packages, the device
type starts with an XQ vs. XC or XA, and the Pb-free signifier in the package name
is Q (for example: VSQD1760).