Packing and Shipping

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

Versal™ devices are packed in trays. Trays are used to pack most of Xilinx surface-mount devices because they provide excellent protection from mechanical damage. In addition, they are manufactured using antistatic material to provide limited protection against ESD damage and can withstand a bake temperature of 125°C.

Table 1. Standard Device Counts per Tray and Box
Package Maximum Number of Devices Per Tray Maximum Number of Units In One Internal Box
SFVB625 60 300
VBVA1024    
VFVB1024    
VFVB1369    
VSVE1369    
VSVA1596    
VIVA1596 12 36
VFVA1760 12 36
VFVC1760 12 36
VSVD1760 12 36
VSVA2197 12 36
Important: All packages are available with eutectic BGA balls. To order these packages, the device type starts with an XQ vs. XC or XA, and the Pb-free signifier in the package name is Q (for example: VSQD1760).