Post Reflow/Cleaning/Washing

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

Many PCB assembly subcontractors use a no-clean process in which no post-assembly washing is required. Although a no-clean process is recommended, if cleaning is required, Xilinx recommends a water-soluble paste and a washer using a deionized-water. Baking after the water wash is recommended to prevent fluid accumulation. Cleaning solutions or solvents are not recommended because some solutions contain chemicals that can compromise the lid adhesive, thermal compound, or components inside the package.