References

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

These documents provide supplemental material useful with this guide:

  1. Versal ACAP data sheets:
    • Versal Architecture and Product Data Sheet: Overview (DS950)
    • Versal Prime Series Data Sheet: DC and AC Switching Characteristics (DS956)
    • Versal AI Core Series Data Sheet: DC and AC Switching Characteristics (DS957)
  2. Versal ACAP SelectIO Resources Architecture Manual (AM010)

Heat Management and Contact Information

The following websites contain additional information on heat management and contact information.

CDF Tools

Refer to the following websites for CFD tools Xilinx supports with thermal models.

Thermal Modeling References

The following papers are referenced for more information on thermal modeling.

  • Lemczyk, T.F., Mack, B., Culham, J.R. and Yovanovich, M.M., 1992, "Printed Circuit Board Trace Thermal Analysis and Effective Conductivity", ASME J. Electronic Packaging, Vol. 114, pp. 413 - 419.50.
  • Refai-Ahmed, G. and Karimanal, K., 2003, "Validation of Compact Conduction Models of BGA Under Realistic Boundary," J. of Components and Packaging Technology, Vol. 26, No. 3, pp. 610-615.
  • Sansoucy, E, Refai-Ahmed, G., and Karimanal, K., 2002, "Thermal Characterization of TBGA Package for an integration in Board Level Analysis," Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego., USA.
  • Karimanal, K. and Refai-Ahmed, G., 2002, "Validation of Compact Conduction Models of BGA Under Realistic Boundary Conditions," Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego, USA.
  • Karminal, K. and Refai-Ahmed, G., 2001, "Compact conduction Model (CCM) of Microelectronic Packages- A BGA Validation Study," APACK Conference on Advances in Packaging, Singapore.