References

These documents provide supplemental material useful with this guide:

1. Versal ACAP data sheets:
   • Versal Architecture and Product Data Sheet: Overview (DS950)
   • Versal Prime Series Data Sheet: DC and AC Switching Characteristics (DS956)
   • Versal AI Core Series Data Sheet: DC and AC Switching Characteristics (DS957)
2. Versal ACAP SelectIO Resources Architecture Manual (AM010)

Heat Management and Contact Information

The following websites contain additional information on heat management and contact information.

• Wakefield
• Boyd/Aavid
• Advanced Thermal Solutions
• Radian Thermal Products
• Thermo Cool
• CTS

Interface Material Sources

• Henkel
• AOS Thermal Compound
• Parker Chomerics
• Kester

CDF Tools

Refer to the following websites for CFD tools Xilinx supports with thermal models.

• Mentor Flotherm
• ANSYS Icepak

Thermal Modeling References

The following papers are referenced for more information on thermal modeling.

• Lemczyk, T.F., Mack, B., Culham, J.R. and Yovanovich, M.M., 1992, "Printed Circuit Board Trace Thermal Analysis and Effective Conductivity", ASME J. Electronic Packaging, Vol. 114, pp. 413 - 419.50.
• Refai-Ahmed, G. and Karimanal, K., 2003, "Validation of Compact Conduction Models of BGA Under Realistic Boundary," J. of Components and Packaging Technology, Vol. 26, No. 3, pp. 610-615.
• Sansoucy, E, Refai-Ahmed, G., and Karimanal, K., 2002, "Thermal Characterization of TBGA Package for an integration in Board Level Analysis," Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego., USA.
• Karimanal, K. and Refai-Ahmed, G., 2002, "Validation of Compact Conduction Models of BGA Under Realistic Boundary Conditions," Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego, USA.
• Karminal, K. and Refai-Ahmed, G., 2001, "Compact conduction Model (CCM) of Microelectronic Packages- A BGA Validation Study," APACK Conference on Advances in Packaging, Singapore.