References

These documents provide supplemental material useful with this guide:

1. Versal device data sheets:
   • Versal Architecture and Product Data Sheet: Overview (DS950)
   • Versal Prime Series Data Sheet: DC and AC Switching Characteristics (DS956)
   • Versal AI Core Series Data Sheet: DC and AC Switching Characteristics (DS957)
   • Versal AI Edge Series Data Sheet: DC and AC Switching Characteristics (DS958)
   • Versal Premium Series Data Sheet: DC and AC Switching Characteristics (DS959)
   • Versal HBM Series Data Sheet: DC and AC Switching Characteristics (DS960)
2. Versal ACAP SelectIO Resources Architecture Manual (AM010)
3. Versal ACAP PCB Design User Guide (UG863)
4. Designing Heatsinks and Thermal Solutions for Xilinx Devices (XAPP1377)
5. Power Design Manager (PDM) tool (download at www.xilinx.com/power)

Heat Management and Contact Information

The following websites contain additional information on heat management and contact information.

• Wakefield
• Boyd/Aavid
• Advanced Thermal Solutions
• Radian Thermal Products
• Thermo Cool
• CTS

Interface Material Sources

• Henkel
• AOS Thermal Compound
• Parker Chomerics
• Kester

CDF Tools

Refer to the following websites for CFD tools AMD supports with thermal models.

• Mentor Flotherm
• ANSYS Icepak

Thermal Modeling References

The following papers are referenced for more information on thermal modeling.

• Lemczyk, T.F., Mack, B., Culham, J.R. and Yovanovich, M.M., 1992, "Printed Circuit Board Trace Thermal Analysis and Effective Conductivity", ASME J. Electronic Packaging, Vol. 114, pp. 413 - 419.50.
• Refai-Ahmed, G. and Karimanal, K., 2003, "Validation of Compact Conduction Models of BGA Under Realistic Boundary," J. of Components and Packaging Technology, Vol. 26, No. 3, pp. 610-615.
• Sansoucy, E, Refai-Ahmed, G., and Karimanal, K., 2002, "Thermal Characterization of TBGA Package for an integration in Board Level Analysis," Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego., USA.
• Karimanal, K. and Refai-Ahmed, G., 2002, "Validation of Compact Conduction Models of BGA Under Realistic Boundary Conditions," Eighth Intersociety on Thermal Conference Phenomena in Electronic Systems, San Diego, USA.
• Karminal, K. and Refai-Ahmed, G., 2001, "Compact conduction Model (CCM) of Microelectronic Packages- A BGA Validation Study," APACK Conference on Advances in Packaging, Singapore.