Silicon and Decoupling Capacitors Height Consideration

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

When designing heat sink attachments for bare-die flip-chip BGA packages, the height of the die above the substrate and also the height of decoupling capacitors must be considered (see the following figure). This is to prevent electrical shorting between the heat sink (metal) and the decoupling capacitors.

Figure 1. Cross Section of Bare-die Flip-chip BGA