Sn/Pb Reflow Soldering

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

The following figure shows typical conditions for solder reflow processing of Sn/Pb soldering using IR/convection. Both IR and convection furnaces are used for BGA assembly. The moisture sensitivity of surface-mount components must be verified prior to surface-mount flow.

Figure 1. Typical Conditions for IR Reflow Soldering of Sn/Pb Solder

Notes in figure:

  1. Maximum temperature range = 225°C (body). Minimum temperature range before 205°C (leads/balls).
  2. Preheat dwell 95–180°C for 120–180 seconds.
  3. IR reflow must be performed on dry packages.