The following figure shows typical conditions for solder reflow processing of Sn/Pb soldering using IR/convection. Both IR and convection furnaces are used for BGA assembly. The moisture sensitivity of surface-mount components must be verified prior to surface-mount flow.
Figure 1. Typical Conditions for IR Reflow Soldering of Sn/Pb
Solder
Notes in figure:
- Maximum temperature range = 225°C (body). Minimum temperature range before 205°C (leads/balls).
- Preheat dwell 95–180°C for 120–180 seconds.
- IR reflow must be performed on dry packages.