Standard Heat Sink Attach Process with Thermal Conductive Adhesive

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English
Prior to attaching the heat sink, theVersal device needs be surface mounted on the motherboard.
  1. Place the motherboard into a jig or a fixture to hold the motherboard steady to prevent any movement during the heat sink attachment process.
  2. Thermoset material (electrically non-conductive) is applied over the backside surface of silicon in a pattern using automated dispensing equipment. Automated dispensers are often used to provide a stable process speed at a relatively low cost. The optimum dispensing pattern needs to be determined by the SMT supplier.
    Note: Minimal volume coverage of the backside of the silicon can result in non-optimum heat transfer
  3. The heat sink is placed on the backside of the silicon with a pick and place machine. A uniform pressure is applied over the heat sink to the backside of the silicon. As the heat sink is placed, the adhesive spreads to cover the backside silicon. A force transducer is normally used to measure and limit the placement force.
  4. The epoxy is cured with heat at a defined time.
    Note: The epoxy curing temperature and time is based on manufacturer’s specifications.