Prior to attaching the heat sink, the Versal device needs be surface mounted on the motherboard.
- Place the motherboard into a jig or a fixture to hold the motherboard steady to prevent any movement during the heat sink attachment process.
- Thermoset material (electrically non-conductive) is applied over
the backside surface of silicon in a pattern using automated dispensing
equipment. Automated dispensers are often used to provide a stable process speed
at a relatively low cost. The optimum dispensing pattern needs to be determined
by the SMT supplier.Note: Minimal volume coverage of the backside of the silicon can result in non-optimum heat transfer
- The heat sink is placed on the backside of the silicon with a pick and place machine. A uniform pressure is applied over the heat sink to the backside of the silicon. As the heat sink is placed, the adhesive spreads to cover the backside silicon. A force transducer is normally used to measure and limit the placement force.
- The epoxy is cured with heat at a defined time.
Note: The epoxy curing temperature and time is based on manufacturer’s specifications.