Thermal Specifications

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID
AM013
Release Date
2020-07-16
Revision
1.0 English

Versal™ ACAPs are offered exclusively in thermally efficient flip-chip BGA packages. These flip-chip packages range in pin-count from the smaller 21 × 21 mm SFVB625 to the 52.5 × 52.5 mm VSVA2197. This suite of packages is used to address the various power requirements of the Versal ACAPs. Versal devices are implemented in the 7 nm process technology. Unlike features in an ASIC, the combination of Versal ACAP features used in a user application is not known to the component supplier. Therefore, it remains a challenge for Xilinx to predict the power requirements of a given Versal device when it leaves the factory. Accurate estimates are obtained when the board design takes shape. For this purpose, Xilinx offers and supports a suite of integrated device power analysis tools to help users quickly and accurately estimate their design power requirements. Versal ACAPs are supported similarly to previous products. The uncertainty of design power requirements makes it difficult to apply canned thermal solutions to fit all users. Therefore, Xilinx devices do not come with preset thermal solutions. The operating conditions of your design dictate the appropriate solution.