VC1902 Bank Diagram Overview

Versal ACAP Packaging and Pinouts Architecture Manual (AM013)

Document ID: AM013
Release Date: 2020-07-16
Revision: 1.0 English

Revision History
Overview
Introduction to Versal ACAP
Navigating Content by Design Process
Package and Pinout Overview
Device/Package Combinations
Gigabit Transceiver Channels by Device/Package
Differences from Previous Generations
User I/O Pins by Device Package
Pin Definitions
SelectIO Pin Definitions
Power Pin Definitions
PMCMIO, LPDMIO, PMCDIO Pin Definitions
GTY Transceiver Quad Pin Definitions
SYSMON Pin Definitions
Footprint Compatibility between Packages
I/O Bank Footprint Compatibility between Packages
Transceiver Footprint Compatibility between Packages
Die Level Bank Numbering and Device Diagrams
Die Level Bank Numbering Overview
Device Diagrams Overview
VC1802 Bank Diagram Overview
Bank Diagram by Package for VC1802
VC1902 Bank Diagram Overview
Bank Diagram by Package for VC1902
VM1802 Bank Diagram Overview
Bank Diagram by Package for VM1802
Package Files
About ASCII Package Files
Package Specifications Designations
ASCII Pinout Files
Device Diagrams
VIVA1596 Package—VC1802
VIVA1596 Package—VC1902
VFVC1760 Package—VM1802
VSVD1760 Package—VC1802
VSVD1760 Package—VC1902
VSVD1760 Package—VM1802
VSVA2197 Package—VC1802
VSVA2197 Package—VC1902
VSVA2197 Package—VM1802
Mechanical Drawings
VIVA1596 Package—VC1802 and VC1902
VFVC1760 Package—VM1802
VSVD1760 Package—VC1802, VC1902, and VM1802
VSVA2197 Package—VC1802, VC1902, and VM1802
Package Marking
Packing and Shipping
Soldering Guidelines
Sn/Pb Reflow Soldering
Pb-Free Reflow Soldering
Peak Package Reflow Temperatures
Post Reflow/Cleaning/Washing
Conformal Coating
Strain Gauge Measurement
Solder Paste
Component Placement
Component Pick-up Tool Consideration
Recommended PCB Design Rules for BGA
Stencil
Edge Bonding Guidelines
Edge Bonding Implementation
Edge Bond Removal
Thermal Specifications
Support for Thermal Models
Thermal Management Strategy
Flip-Chip Packages
System Level Heat Sink Solutions
Thermal Interface Material
Types of TIM
Guidelines for Thermal Interface Materials
Heat Sink Removal
Measurement Debug
Heat Sink Guidelines for Bare-die VB Packages
Heat Sink Attachments
Silicon and Decoupling Capacitors Height Consideration
Types of Heat Sink Attachments
Heat Sink Attachment Process Considerations
Standard Heat Sink Attach Process with Thermal Conductive Adhesive
Standard Heat Sink Attach Process with Thermal Adhesive Tape
Push-Pin and Shoulder Screw Heat Sink Attachment Process with Phase Change Material (PCM) Application
Mechanical and Thermal Design Guidelines for Lidless Flip-chip Packages
Lidless Flip-Chip Packages
Additional Resources and Legal Notices
Xilinx Resources
Documentation Navigator and Design Hubs
References
Please Read: Important Legal Notices

Figure 1. VC1902 Banks

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