Inlet Temperature versus Airflow Requirement in Server

T2 Telco Accelerator Card Data Sheet (DS1000)
Document ID
DS1000
Release Date
2022-06-08
Revision
1.0 English

The following tables provide the required airflow rate and airflow speed to the T2 Telco accelerator card under various operating conditions.

Table 1. T2 Normal Flow (Exhaust Air from I/O Bracket) at Sea Level
Inlet Temperature versus Airflow Requirement out of I/O Bracket for PCIe Card Slot (56.51 mm x 20.33 mm) at Sea Level for 50W Total Card Power
Inlet Temperature to the Card I/O Bracket (70°C)
CFM LFM Static Pressure
25 1.7 140 0.10
30 2.0 160 0.11
35 2.3 190 0.14
40 2.8 230 0.17
45 3.7 300 0.24
50 5.1 410 0.37
55 7.8 630 0.68
Table 2. T2 Normal Flow (Exhaust Air from I/O Bracket) at 1800m above Sea Level
Inlet Temperature versus Airflow Requirement out of I/O Bracket forPCIe Card Slot (56.51 mm x 20.33 mm) at 1800m above Sea Level for 50W Total Card Power
Inlet Temperature to the Card CFM LFM Static Pressure
25 1.9 150 0.10
30 2.2 180 0.13
35 2.6 210 0.16
40 3.2 260 0.20
45 4.2 340 0.29
50 5.8 470 0.45
55 8.8 710 0.82
Table 3. T2 Reverse Flow (Inlet Air from I/O Bracket) at Sea Level
Inlet Temperature versus Airflow Requirement into I/O Bracket for PCIe Card Slot (66.87 mm x 13.18 mm) at Sea Level for 50W Total Card Power
Inlet Temperature to the Card I/O Bracket (70°C)
CFM LFM Static Pressure
25 0.9 100 0.08
30 1.1 120 0.09
35 1.3 140 0.11
40 1.5 160 0.13
45 1.9 200 0.17
50 2.3 240 0.22
55 2.9 310 0.3
Table 4. T2 Reverse Flow (Inlet Air from I/O Bracket) at 1800m above Sea Level
Inlet Temperature versus Airflow Requirement into I/O Bracket forPCIe Card Slot (66.87 mm x 13.18 mm) at 1800m above Sea Level for 50W Total Card Power
Inlet Temperature to the Card CFM LFM Static Pressure
25 1.0 110 0.09
30 1.2 130 0.10
35 1.4 150 0.12
40 1.7 180 0.15
45 2.1 220 0.19
50 2.6 270 0.25
55 3.3 350 0.35