CIN
2
|
HDIO and PSIO die input capacitance at the pad |
– |
– |
3.50 |
pF |
XPIO die input capacitance at the pad |
– |
– |
1.75 |
pF |
IRPU
|
Pad pull-up (when selected) at VIN = 0V, VCCO = 3.3V |
60
|
– |
200
|
µA |
Pad pull-up (when selected) at VIN = 0V, VCCO = 2.5V |
50
|
– |
169
|
µA |
Pad pull-up (when selected) at VIN = 0V, VCCO = 1.8V |
29
|
– |
120
|
µA |
Pad pull-up (when selected) at VIN = 0V, VCCO = 1.5V |
30
|
– |
120
|
µA |
Pad pull-up (when selected) at VIN = 0V, VCCO = 1.2V |
10
|
– |
100
|
µA |
IRPD
|
Pad pull-down (when selected) at VIN = 3.3V |
60
|
– |
200
|
µA |
Pad pull-down (when selected) at VIN = 1.8V |
29
|
– |
120
|
µA |
ICC_FUSE
|
VCC_FUSE supply current during eFUSE
programming |
– |
– |
165 |
mA |
Battery Supply Current for VP1002,
VP1052, VP1102, VP1202, and VP1402 Devices |
ICC_BATT
3, 4
|
Battery supply current at VCC_BATT = 1.20V, RTC disabled |
– |
– |
160 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC disabled |
– |
– |
320 |
nA |
Battery supply current at VCC_BATT = 1.20V, RTC enabled |
– |
– |
1360 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC enabled |
– |
– |
1930 |
nA |
Battery Supply Current for VP1502,
VP1552, and VP2502 Devices |
ICC_BATT
3, 4
|
Battery supply current at VCC_BATT = 1.20V, RTC disabled |
– |
– |
320 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC disabled |
– |
– |
640 |
nA |
Battery supply current at VCC_BATT = 1.20V, RTC enabled |
– |
– |
1520 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC enabled |
– |
– |
2250 |
nA |
Battery Supply Current for VP1702
Devices |
ICC_BATT
3, 4
|
Battery supply current at VCC_BATT = 1.20V, RTC disabled |
– |
– |
480 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC disabled |
– |
– |
960 |
nA |
Battery supply current at VCC_BATT = 1.20V, RTC enabled |
– |
– |
1680 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC enabled |
– |
– |
2570 |
nA |
Battery Supply Current for VP1802
and VP2802 Devices |
ICC_BATT
3, 4
|
Battery supply current at VCC_BATT = 1.20V, RTC disabled |
– |
– |
640 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC disabled |
– |
– |
1280 |
nA |
Battery supply current at VCC_BATT = 1.20V, RTC enabled |
– |
– |
1840 |
nA |
Battery supply current at VCC_BATT = 1.50V, RTC enabled |
– |
– |
2890 |
nA |
Calibrated programmable on-die
termination (DCI) in
XPIO
banks
5
(measured per JEDEC specification) |
R
7
|
Thevenin equivalent resistance of programmable input termination
where x = target impedance of 48, 60, 120, or 240 |
–20%
6
|
ODT = RTT_x |
+20%
6
|
Ω |
Uncalibrated programmable on-die
termination in HDIO banks (measured per JEDEC specification) |
R
7
|
Thevenin equivalent resistance of programmable input termination
to VCCO/2 where ODT = RTT_48 |
–50% |
48 |
+50% |
Ω |
Differential termination |
Programmable differential termination (TERM_100) for
XPIO
banks |
–35% |
100 |
+35% |
Ω |
- Typical values are specified at nominal
voltage, 25°C.
- This measurement represents the die
capacitance at the pad, not including the package.
- Maximum value specified for worst
case process at 25°C.
- Battery-backed RAM (BBRAM) is
always enabled and included in ICC_BATT
.
- VR resistor
tolerance is (240Ω ±1%).
- The tolerance
limits are specified after calibration with stable voltage and temperature.
- On-die input
termination resistance, for more information see the
Versal
ACAP SelectIO Resources Architecture Manual (AM010).
|