Absolute Maximum Specifications

Kria K26 SOM Data Sheet (DS987)

Document ID
Release Date
1.2 English

The following tables describe the absolute maximum specifications.

Table 1. Absolute Maximum Ratings
Symbol Description 1, 2 Min Max Units
VCC_SOM Primary supply voltage for the SOM –0.500 6.000 V
VCCO Output drivers supply voltage for HD I/O banks (HDA, HDB, HDC) –0.500 3.400 V
Output drivers supply voltage for HP I/O banks (HPA, HPB, HPC) –0.500 2.000 V
VIN 3, 4 I/O input voltage for HD I/O banks –0.550 VCCO + 0.550 V
I/O input voltage for HP I/O banks –0.550 VCCO + 0.550 V
I/O input voltage for MIO (PS I/O) –0.550 2.350 V
VCC_BATT PS battery-backed RAM and battery-backed real-time clock (RTC) supply voltage –0.500 2.000 V

GTH Transceivers 5, 6

VMGTREFCLK Transceiver reference clock absolute input voltage –0.500 1.300 V
VIN Receiver (RXP/RXN) and transmitter (TXP/TXN) absolute input voltage –0.500 1.200 V
Temperature 7
TSTG Storage temperature (ambient) –65 150 °C
  1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
  2. For more information on absolute ratings see Zynq UltraScale+ MPSoC Data Sheet: DC and AC Switching Characteristics (DS925).
  3. The lower absolute voltage specification always applies.
  4. For I/O operation, see the UltraScale Architecture SelectIO Resources User Guide (UG571).
  5. For more information on supported GTH transceiver terminations see the UltraScale Architecture GTH Transceivers User Guide (UG576).
  6. DC coupled operation is not supported for RX termination = programmable.
  7. For thermal considerations, see the Kria K26 SOM Thermal Design Guide (UG1090) and the Power Design Manager (PDM) tool (download at www.xilinx.com/power).