K26 Reliability

Kria K26 SOM Data Sheet (DS987)

Document ID
DS987
Release Date
2022-03-15
Revision
1.2 English

The following table captures a summary of the reliability testing completed on the K26 SOM. All reliability testing was done with the production SOM assembly inclusive of the circuit card assembly and aluminum heat spreader. For the full K26 SOM reliability and qualification report request access to the Kria SOM Qualification Report Lounge .

Table 1. Reliability Testing
Reliability Test K26C SOM (Commercial) K26I SOM (Industrial)
Temperature cycling JESD22-A104, Condition J (0°C to 100°C) JESD22-A104, Condition T (–40°C to 100°C)
Power cycling Ta = 50°C, RH = 80%; 55 min ON, 5 min OFF Ta = 50°C, RH = 80%; 55 min ON, 5 min OFF
Strife power cycling Power cycling, 0°C; 1 min ON, 1 min OFF Power cycling, –40°C; 1 min ON, 1 min OFF
Temperature and humidity Ta = 85°C, RH = 85% Ta = 85°C, RH = 85%
Mechanical vibration IEC 60068-2-64, 1.9 Grms IEC 60068-2-64, 5.04 Grms
Mechanical shock IEC 60068-2-27, 40 G IEC 60068-2-27, 100 G
Connector insertion life Room temperature, all the following connectors: dual 240-pin connectors. Room temperature, all the following connectors: dual 240-pin connectors.
  1. Samtec has performed connector level testing following EIA-364-09C, while Xilinx has performed mechanical wellness testing of the bond between the PCB and the mating connector. Refer to the Samtec website for more information on connector reliability specifications.