Mechanical and Thermal

Kria K26 SOM Data Sheet (DS987)

Document ID
DS987
Release Date
2022-03-15
Revision
1.2 English
The production K26 SOM is available in both commercial and industrial temperature grades. The temperature specification is defined relative to the junction temperature of the MPSoC as measured by the integrated System Monitor. All the other components on the SOM should remain within their operating limits as long as temperature is maintained in the MPSoC. Your design is expected to have a thermal solution connected to the integrated heat spreader, this is to maintain the operating temperature within these limits under the operating conditions (i.e., ambient temperature, airflow, etc.) of your system.
Table 1. K26 SOM Specifications
K26 SOM Operating Temperature
Commercial grade: K26C SOM 0°C to 85°C (as measured at MPSoC junction temperature)
Industrial grade: K26I SOM –40°C to 100°C (as measured at MPSoC junction temperature)

The K26 SOM is supplied with an aluminum heat spreader. This heat spreader makes full contact with all the high-power active components, including the MPSoC, DDR4, eMMC, and power regulators. The primary function of the heat spreader is to transfer the non-uniform heat distribution of the module that is generated on the PCB assembly to the heat spreader, making the heat flux more uniform and spread over a larger surface area. This allows for more efficient heat transfer out of the package to an attached cooling device and simplifies thermal design. The user-defined system cooling solutions should be designed to directly attach to the heat spreader.

Figure 1. K26 SOM

Important: The thermal solution on your system must provide adequate cooling to maintain all the components on the PCB (including the K26 SOM) at below the maximum temperature specifications as detailed in Table 1.