The production K26 SOM is available in both commercial and industrial
temperature grades. The temperature specification is defined relative to the junction
temperature of the MPSoC as measured by the integrated System Monitor. All the other
components on the SOM should remain within their operating limits as long as temperature
is maintained in the MPSoC. Your design is expected to have a thermal solution connected
to the integrated heat spreader, this is to maintain the operating temperature within
these limits under the operating conditions (i.e., ambient temperature, airflow, etc.)
of your system.
K26 SOM | Operating Temperature |
---|---|
Commercial grade: K26C SOM | 0°C to 85°C (as measured at MPSoC junction temperature) |
Industrial grade: K26I SOM | –40°C to 100°C (as measured at MPSoC junction temperature) |
The K26 SOM is supplied with an aluminum heat spreader. This heat spreader makes full contact with all the high-power active components, including the MPSoC, DDR4, eMMC, and power regulators. The primary function of the heat spreader is to transfer the non-uniform heat distribution of the module that is generated on the PCB assembly to the heat spreader, making the heat flux more uniform and spread over a larger surface area. This allows for more efficient heat transfer out of the package to an attached cooling device and simplifies thermal design. The user-defined system cooling solutions should be designed to directly attach to the heat spreader.
Figure 1.
K26
SOM
Important: The
thermal solution on your system must provide adequate cooling to maintain all the
components on the PCB (including the K26 SOM) at below the maximum temperature specifications
as detailed in Table 1.