The K26 SOM is available in the commercial and industrial temperature grades. The K26C SOM and K26I SOM support different temperature ranges.
|K26 SOM||Operating Temperature|
|K26C SOM||0°C to 85°C|
|K26I SOM||–40°C to 100°C|
|Heat spreader plate (HSP-00075-01)||C grade||70°C maximum|
|I grade||85°C maximum|
The K26 SOM is supplied with an aluminum heat spreader (HS). This heat spreader makes full contact with all the high-power active components, including the Zynq UltraScale+ MPSoC, DDR4 memory, eMMC, power management integrated circuit (PMIC), and power regulators. The primary function of the heat spreader is to transfer the non-uniform heat distribution of the module that is generated on the PCB assembly to the heat spreader, making the heat flux more uniform and spread over a larger surface area. This allows for more efficient heat transfer out of the package to an attached cooling device. The user-defined system cooling solutions should be designed to directly attach to the heat spreader.
The heat spreader has four M3 mounting holes on the corners to attach the appropriate thermal solution for your system. Further details are available in the Kria SOM Carrier Card Design Guide (UG1091). Your system thermal solution must provide adequate cooling to maintain all the components on the PCB, including the K26 SOM, below the maximum temperature specifications as detailed in Table 1.