Numerical simulation plays an important role in thermal design. The thermal requirements of the on-board components are the prime reason for cooling selection and mechanical design parameters. With this thermal design guide, Xilinx provides K26 SOM compact thermal models in both Icepak and Flotherm formats to enable system cooling design based upon your system thermal power and boundary conditions. The thermal models have the heat spreader integrated as a thermal interface base to help you build a solution to install on it with a selected TIM (see the detailed thermal stack up in Figure 1).
Figure 1.
K26 SOM
Icepak Compact Model
Figure 2.
K26 SOM
Flotherm Compact Model
