Introduction

Xilinx® Versal® architecture, UltraScale™ architecture, 7 series, and 6 series devices come in a variety of packages that are designed for maximum performance and maximum flexibility. Four pitch sizes are available for these packages: 1.0 mm, 0.92 mm, 0.8 mm, and 0.5 mm. In general, as the pitch size decreases, the challenges for PCB routing increase as there is less room to route traces and vias between package balls. This guide illustrates various methods for successful design regardless of pitch size.