Table 1. Package Details (All Dimensions in mm)
| Package |
Size |
I/O |
Pitch |
Ball/Column Size |
Pad Opening |
Pad Type |
Die Size |
Substrate |
| FBG900 |
31 X 31 |
900 |
1.00 |
0.60 |
0.53 |
SMD |
12.93 x 16.91 |
0.95 thick, 8-layer |
Mother Board Design and Assembly Details
- 8-layer, FR-4, 220 x 140 x 2.36 mm size, ENIG finish
- 0.45 mm pad diameter/0.55 mm solder mask opening (NSMD pads)
- Board layer structure: signal/GND/signal/power/signal/GND/signal/power
- Power, GND layer has 70% metal. Internal signal layer has 40% metal.
- 0.127 mm laser cut stencil, 0.50 mm aperture, alpha metals WS820 paste
Test Condition
- 0°C–100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate
Failure Criteria
- Continuous scanning of daisy chain nets with event detection
- FAIL: Resistance of net > threshold resistance (500Ω), 10 events (maximum), 1 μs duration (maximum)
Table 2. Summary of Test Results
| Package |
Cycles Completed |
Number Tested |
Number Failed |
First Failure (Cycle) |
Characteristic Life (Cycle) |
| FBG900 |
10,085 |
32 |
18 |
5,674 |
9,148 |
Weibull Plots
Figure 1. Cycles to Failure in the Second-Level Reliability Tests for
FBG900
