Highly Accelerated Temperature and Humidity Stress Test

Device Reliability Report (UG116)

Document ID
UG116
Release Date
2023-05-17
Revision
10.17 English

The HAST test is conducted under the conditions of 130°C, 85% RH and VDD bias or 110°C, 85% RH and VDD bias. Package preconditioning is performed on the testing samples prior to the HAST test.

Summary

Table 1. Summary of High Accelerated Stress Test Results
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC3SxxxA 110°C / 85%RH 2 0 90 47,520
XC6Sxxx 110°C / 85%RH 4 0 180 71,280
7 series FPGAs and Zynq-7000 SoCs 110°C / 85%RH 11 0 488 257,664

Data

Table 2. Summary of HAST Test Results XC3SxxxA
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC3S200A 110°C / 85%RH 2 0 90 47,520
XC3SxxxA 110°C / 85%RH 2 0 90 47,520
Table 3. Summary of HAST Test Results XC6Sxxx
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC6SLX45 110°C / 85%RH 4 0 180 71,280
XC6Sxxx 110°C / 85%RH 4 0 180 71,280
Table 4. Summary of HAST Test Results 7 series FPGAs and Zynq-7000 SoCs
Device Stress Condition Lot Quantity Fail Quantity Device Quantity Total Device Cycles
XC7A35T 110°C / 85%RH 4 0 179 94,512
XC7Z020 110°C / 85%RH 7 0 309 163,152
7 series FPGAs and Zynq-7000 SoCs 110°C / 85%RH 11 0 488 257,664