SFVA784 and SBVA784

Device Reliability Report (UG116)
Document ID
UG116
Release Date
2023-05-17
Revision
10.17 English
Table 1. Package Details (All Dimensions in mm)
Package Size I/O Pitch Ball/ Column Size Pad Opening Pad Type Die Size Substrate
SFVA784 23 x 23 784 0.8 0.50 0.40 SMD 16.3 x 11.36 1.33 thick, 12-layer
SBVA784 23 x 23 784 0.8 0.50 0.40 SMD 16.3 x 11.36 1.33 thick, 12-layer

Mother Board Design and Assembly Details

  • 28-layer, Megtron-6, 305 x 140 x 3.4 mm size, OSP finish
  • 0.40 mm pad diameter/0.50 mm solder mask opening (NSMD pads)
  • Power, GND layer has 70% metal. Internal signal layer has 40% metal.
  • 0.127 mm laser cut stencil, 0.40 mm aperture, SAC305 solder paste.

Test Condition

  • 0°C–100°C, 40-minute thermal cycle, 10-minute dwells, 10°C/minute ramp rate

Failure Criteria

  • Continuous scanning of daisy chain nets with event detector
  • FAIL: Resistance of net > threshold resistance (500Ω) and lasting greater than 1 μs, followed by >9 events within 10% of the cycles to initial failure.
Table 2. Summary of Test Results­
Package Cycles Completed Number Tested Number Failed First Failure (Cycle) Characteristic Life (Cycle)
SFVA784 6800 32 25 5049 6540
SBVA784 6140 32 25 4120 5718

Weibull Plots

Figure 1. Cycles to Failure in the Second-Level Reliability Tests for SFVA784
Figure 2. Cycles to Failure in the Second-Level Reliability Tests for SBVA784