Features

T1 Telco Accelerator Card User Guide (UG1495)

Document ID
UG1495
Release Date
2021-12-17
Revision
1.0 English

A high-level block diagram of the T1 card card is shown in the following figure.

Figure 1. T1 card High-Level Block Diagram

The main features and components of the T1 card are as follows:

  • Xilinx ZU19EG MPSoC device targeting 5G fronthaul termination
  • Xilinx ZU21DR RFSoC device targeting L1 channel coding
  • Dual NOR flash of 2x 256 MB in QSPI mode for Zynq UltraScale+ MPSoC
  • Dual NOR flash of 2x 256 MB in QSPI mode for Zynq UltraScale+ RFSoC
  • 4 GB of DDR4 programmable logic (PL) memory to each Zynq UltraScale+ MPSoC and Zynq UltraScale+ RFSoC device
  • 2 GB of DDR4 processor system (PS) memory to each Zynq UltraScale+ MPSoC and Zynq UltraScale+ RFSoC device
  • 100G (MAC-to-MAC) communication link between Zynq UltraScale+ MPSoC and Zynq UltraScale+ RFSoC devices
  • Two SFP28 cages supporting up to 25G signaling and pluggable optics
  • IEEE 1588 Network Synchronizer timing circuit with PPS in/out connectors
  • Satellite controller for IPMI compliant monitoring and telemetry
  • Bifurcated x8x8 PCIe Gen 3 x16 link to the host from each FPGA
  • FHHL form factor with a 75W power envelope
  • x16 standard card form factor (FHHL), single slot (111.15 mm x 167.65 mm)
  • Maintenance port for card maintenance and developer access using the DMB II Interface (proprietary, requires Xilinx® DMB II kit)