When planning the PCB, you must take power into consideration:
- The device and the user design create system power supply and heat dissipation requirements.
- Power supplies must be able to meet maximum power requirements and the device must remain within the recommended voltage and temperature operating conditions during operation. Power estimation and thermal modeling are required to ensure that the device stays within these limits.
- Plan for the consolidation of power rails and their impact on power domain switching.
- Although consolidation is possible, AMD recommends using full power management to give maximum flexibility where possible.
For these reasons, you must understand the power and cooling requirements of the device. These must be designed on the board.
Power Tip:
For more information, see this link in the
Versal Adaptive SoC System and Solution Planning Methodology
Guide (UG1504). For a list of
AMD partners and AMD-approved power delivery reference designs, see the Power page on the Xilinx.com
website.