The ZCU670 evaluation board features are listed here. Detailed information for each feature is provided in Board Component Descriptions.
- ZU67DR-2, FSVE1156 package
- Form factor: see Board Specifications
- Configuration from:
- Dual QSPI
- Micro-SD card
- USB-to-JTAG bridge
- PC4 2x7 2 mm JTAG pod flat cable header
- Clocks
- SI5381 (various frequencies)
For additional details on this clock, see Table 1, Table 2, and SI5381A 10 Independent Output Any-Frequency Clock Generator U43.
- CLK104 (various frequencies):
Optional for DFE. Contact factory for availability.
- CLK104_PL_CLK
- CLK104_PL_SYSREF
- CLK104_AMS_SYSREF
- CLK104_DAC_REFCLK (direct connect SSMP)
- 8A34001 IEEE 1588, Synchronous Ethernet (SyncE), and
eCPRI clock (various frequencies)
For additional details on this clock, see Table 1, Table 2, and SI5381A 10 Independent Output Any-Frequency Clock Generator U43.
- PS_REF_CLK 33.333333...(33 + 1/3 MHz)
- ADC_CLK_226 (direct connect SSMP)
For additional details on this clock, see Table 1, Table 2, and Programmable User SI570 Clocks.
- DAC_CLK_228 (direct connect SSMP)
- USER_MGT_SI570 (default 156.25 MHz)
For additional details on this clock, see Table 1, Table 2, and Programmable User SI570 Clocks.
- USER_SI570_C0 (default 300 MHz)
For additional details on this clock, see Table 1, Table 2, and Programmable User SI570 Clocks.
- User SMA clocks
For more information, see User SMA Clocks.
- SI5381 (various frequencies)
- PS DDR4 4 GB 64-bit SODIMM
- PL DDR4 C0 I/F 2 GB 32-bit component (4x8-bit)
- PS GTR (bank 505) assignment
- USB3 (1 GTR)
- FMCP HSPC DP (3 GTR)
- PL GTY assignment (2 quads, 8 total GTY)
- 2x2 zSFP+ (4 GTY on bank GTY127)
- FMCP HSPC DP (4 GTY, bank GTY128)
- PS MIO connectivity
- PS MIO[0:5, 7:12]: dual QSPI
- PS MIO[13]: PS_GPIO2
- PS MIO[14:17]: 2 channels of I2C
- PS MIO[18:19]: UART0 (1 of 3 FT4232 UART channels)
- PS MIO[22:23]: PS_PB, PS_LED I/F
- PS MIO[26]: PMU_INPUT
- PS MIO[27:30]: SFP[0:3] TX_DISABLE
- PS MIO[32:37]: PMU_GPO[0:5]
- PS MIO[38]: PS_GPIO1
- PS MIO[39:43, 45:51]: SD I/F
- PS MIO[52:63]: USB3.0
- PS MIO[64:77]: Ethernet RGMII
- PL I/O connections
- PL user GPIO pushbutton
- PL CPU reset pushbutton
- PL user GPIO LEDs (4)
- Security—PSBATT button battery backup
- SYSMON header
- Operational switches (power on/off, PS_PROG_B, boot mode DIP switch)
- Operational status LEDs (INIT, DONE, PS STATUS, PGOOD)
- Power management
- System controller (MSP430)
The ZCU670 provides a rapid prototyping platform that uses the XCZU67DR-2FSVE1156I device. The ZU67DR contains many useful processor system (PS) hard block peripherals exposed through the multi-use I/O (MIO) interface and a variety of FPGA programmable logic. The following table lists a brief summary of the resources available within the ZU67DR.
Feature set overview, description, and ordering information is provided in the Zynq UltraScale+ RFSoC DFE Data Sheet: Overview (DS883).
Feature | Resource Count |
---|---|
Digital front end | Included |
14-bit 2.95 GSPS RF-ADC with DDC | 8 |
14-bit 5.9 GSPS ADC RF-DAC with DDC | 2 |
14-bit 10 GSPS RF-DAC with DUC | 8 |
APU: Quad-core Arm® Cortex®-A53 MPCore with CoreSight™ | 1 |
RTPU: Dual-core Arm Cortex-R5F MPCore with CoreSight | 1 |
HD I/O | 96 |
HP I/O | 312 |
MIO banks | 3 banks, total of 78 pins |
PS GTR 6 Gb/s transceivers | 4 PS-GTRs |
PL GTY 28 Gb/s transceivers | 8 GTYs |
System logic cells | 489,300 |
CLB flip-flops | 447,360 |
CLB LUTs | 223,680 |
Maximum distributed RAM (Mb) | 6.9 |
Block RAM blocks | 648 |
UltraRAM blocks | 160 |
DSP slices | 1,872 |
100G Ethernet with RS-FEC | 1 |