Use this format to export the XPE environmental, thermal and budget information
in the form of Xilinx design constrains (*.xdc) file
using the set_operating_condition
commands. The exported
file can be sourced in Vivado project to get the same
design constraints as set in XPE. This file will have the following information in the
exported *.xdc file:
- Device Process
- Junction Temperature
- Ambient Temperature
- Airflow
- Heat sink
- Board and board layers
- Voltage
- Design Power Budget
Note:
*.xdc export feature is available only for UltraScale+ XPE spreadsheet.