1. Footprint Compatibility between Packages

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

Any two packages with the same footprint identifier code are footprint compatible. The footprint identifier code consists of a package designator code and BGA pin count information (such as B1156 or C1156, for example). A customer that wants pin compatibility across any two devices in a given package should select a footprint compatible package such that they can be designed to be electrically compatible. If migrating from a bigger device to a smaller device within the same package, some I/O and transceiver banks and their pins might be unbonded or not exist on the smaller device. Refer to the Footprint Compatibility, I/O Bank Migration, and Transceiver Quad Migration tables in Zynq UltraScale+ MPSoC Packaging and Pinouts Product Specification User Guide (UG1075) [Ref 26] to determine which Zynq UltraScale+ MPSoCs are footprint compatible, as well as the extent to which the various banks might become unbonded or not exist.