Migration across devices, especially from smaller to bigger devices, can result in higher power consumption requiring improved thermal management and power delivery. Consult the Xilinx Power Estimator (XPE) tool and select the largest device being considered in order to estimate power consumption and thermal requirements.
RECOMMENDED: AMD recommends use of the Delphi thermal model during thermal modeling of a package. The Delphi thermal model includes consideration of the thermal interface material parameters and the manufacture variation on the thermal solution. Examples of manufacture variations include the tolerance in airflow from a fan, the tolerance on performance of the heat pipe and vapor chamber, and the manufacture variation of the attachment of fins to the heat sink base and the flatness of the surface. Further information regarding thermal considerations can be found in the Thermal Management Strategy chapter of Zynq UltraScale+ MPSoC Packaging and Pinouts Product Specification User Guide (UG1075) [Ref 26].