Migration across devices, especially from smaller to bigger devices, can result in higher power consumption requiring improved thermal management and power delivery. Consult the Xilinx Power Estimator (XPE) tool and select the largest device being considered in order to estimate power consumption and thermal requirements.
RECOMMENDED: AMD recommends use of the Delphi thermal model during thermal modeling of a package. AMD does not recommend using a two-resistor model for thermal simulation and design due to lack of precision and accuracy. If more accuracy is desired than the Delphi model, AMD can provide a detailed model representation of the package by request. However, this might consume more simulation memory and run time in its use. The user of the thermal model needs to include a consideration of thermal sensor accuracy, thermal interface material parameters, and manufacture variation on the thermal solution. Also, other examples of manufacture variations include the tolerance in airflow from a fan, the tolerance on performance of the heat pipe and vapor chamber, and the manufacture variation of the attachment of fins to the heat-sink base and the flatness of the surface.