Package dimensions for UltraScale devices can vary from one package to another, so care must be taken in system design to ensure that changes in length, width, or height do not interfere with other components in the system. Some packages are also “overhang” packages in that their lengths and widths extend further beyond the pin array than other devices with similar pin counts. If migrating from a smaller package to a bigger package, ensure that an appropriate keep-out area is in place so that no capacitors or other components interfere with the bigger outline. Refer to the Mechanical Drawings chapter in UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575) for the dimensions of the various UltraScale device packages.