Certain UltraScale devices that are footprint compatible in a package might have different I/O bank and transceiver Quad numbers associated with the same package pins. Depending on where these banks are physically located on the die, certain multi-bank interfaces (such as memory or transceiver) could be impacted in regards to migrating from one device to the other. If a bank number change also involves the bank moving from one column on the die to another, a multi-bank interface that requires both banks to be in the same column could be impacted.
Refer to the I/O Bank Migration and Transceiver Quad Migration tables in UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575) [Ref 9] for the bank and transceiver Quad numbering differences. To determine bank locations on a die, refer to the Die Level Bank Numbering Overview section of UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575).
The example below shows a successful migration path despite both bank number changes and banks being in different columns between the two different devices.