Example: Planning Ahead for Bank Number Changes

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

As shown in This Figure, banks 69, 70, and 71 in the XCVU095-FFVD1517 connect to the same pins as banks 71, 72, and 73 in the XCVU125-FLVD1517. This Figure confirms that the multi-bank interface remains intact despite the differing locations on each die. All three banks remain contiguous on each respective die. This would result in a successful migration for interfaces that utilize these three banks, with pin flight times being the only potential differences.

Figure 6-5:      Portion of I/O Bank Migration Table

X-Ref Target - Figure 6-5

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Figure 6-6:      XCVU095 (L) and XCVU125 (R) Bank Locations

X-Ref Target - Figure 6-6

ug583_c3_19.jpg