Examples

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

This Figure shows a snippet of the Footprint Compatibility table from UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575). The XCKU035 in the A1156 (1) package can only be compatible with the XCKU040 and XCKU060 in the A1156 package, but not with any of the devices in the A1517. A design created with the XCKU035 in the A1156 package, for example, can be footprint compatible with any bigger A1156 device.

Figure 6-1:      Portion of Footprint Compatibility Table

X-Ref Target - Figure 6-1

ug583_c3_14.jpg

If migrating from a bigger device to a smaller device within the same package, there exists the potential for some I/O and transceiver banks to not be bonded out or present on the smaller device. This Figure shows a snippet of the Transceiver Quad Migration table from UltraScale and UltraScale+ FPGAs Packaging and Pinouts Product Specification (UG575) [Ref 9]. Transceiver banks 120, 121, 122, 220, 221, and 222 are present on the XCVU160 and XCVU190 C2104 devices, but those transceiver banks are not available on the XCVU080, XCVU095, and XCVU125 C2104 devices.

Figure 6-2:      Transceiver Quad Availability within C2104 Packages

X-Ref Target - Figure 6-2

ug583_c3_15.jpg