Fly-by and Clamshell Topologies

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

Two topology types are supported for DDR4 SDRAM: fly-by, and clamshell. The fly-by topology (This Figure) consists of all memory devices on one layer, usually in-line. This type of topology is generally easier to route and can offer the best signal integrity, but can take up precious board real estate.

Figure 2-18:      Fly-by Topology

X-Ref Target - Figure 2-18

ug583_c2_61.jpg

Clamshell topology (This Figure) requires more intricate routing, but is optimal for designs where board space is at a premium.

 

IMPORTANT:   Clamshell is a supported DDR4 SDRAM topology in the MIG tool and is selectable for Programmable Logic banks only. The PS in the Zynq UltraScale+ MPSoC does not have a selectable clamshell configuration option. However, the PS can be configured as clamshell if set up as a dual-rank configuration with the first rank on the top layer, and the second rank mirrored on the bottom layer. When utilizing this topology within the AMD Vivado™ tools, refer to the Clamshell Topology section in UltraScale Architecture-Based FPGAs Memory IP Product Guide (PG150) [Ref 13] for additional information.

Figure 2-19:      Clamshell Topology

X-Ref Target - Figure 2-19

ug583_c2_62.jpg