LPDDR3 SDRAM Control Fly-by Termination for x64 Two-SDRAM System

UltraScale Architecture PCB Design User Guide (UG583)

Document ID
UG583
Release Date
2023-11-14
Revision
1.27 English

With high-speed signaling in LPDDR3 SDRAMs, point-to-point topology is used for address and command signals to achieve the best signal integrity. However, due to pin limits on the FPGA side, control signals are routed from the FPGA to two SDRAMs in fly-by topology in a x64 two-SDRAM system. This Figure shows the control fly-by termination for LPDDR3 SDRAM.

Figure 2-57:      Control Fly-by Termination for LPDDR3 SDRAM

X-Ref Target - Figure 2-57

ug583_c8_31.jpg

Table: LPDDR3 SDRAM Impedance, Length, and Spacing Guidelines for Control Signals (CKE/CS/ODT) shows the LPDDR3 SDRAM impedance, length, and spacing guidelines for control signals for a x64 two-SDRAM system.

Table 2-67:      LPDDR3 SDRAM Impedance, Length, and Spacing Guidelines for
Control Signals (CKE/CS/ODT)

Parameter

L0
(Device Breakout)

L1
(Main PCB)

L2
(DRAM Breakout)

L3
(DRAM to DRAM)

L4
(OBT)

Units

Trace type

Stripline

Stripline

Stripline

Stripline

Stripline

-

Single-ended impedance Z0

52±10%

39±10%

52±10%

52±10%

50±10%

W

Trace width (nominal)

3.5

6.0

3.5

3.5

4.0

mil

Trace length

0.0~0.55

1.2~4.0

0.0~0.3

2.0~2.4

0.0~0.5

inch

Spacing in cmd/addr/ctrl signals (minimum)

4.0

8.0

4.0

4.0

8

mil

Spacing to clock signals (minimum)

8.0

20

8.0

20

20

mil

Spacing to other group signals (minimum)

8.0

30

8.0

30

30

mil

Maximum PCB via count

4

mil

Notes:

1.See item 2 in General Memory Routing Guidelines.

2.The entire trace length between two SDRAM control signal balls including breakout region should be between 2.0 to 2.4 inches.

3.Clock, address, and command point-to-point traces at the second SDRAM need to have an extra 0.5 inch added when compared to the control trace to compensate for control double loading.